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The PowerMESH™II is the evolution of the first generation of MESH OVERLAY™. The layout refinements introduced greatly improve the Ron*area figure of merit while keeping the device at the leading edge for what concerns swithing speed, gate charge and ruggedness.
STW10NC60 Maximum Ratings
Symbol
Parameter
Value
Unit
STW10NC60
STH10NC60FI
VDS
Drain-source Voltage (VGS = 0)
600
V
VDGR
Drain-gate Voltage (RGS = 20 kW)
600
V
VGS
Gate- source Voltage
±30
V
ID
Drain Current (continuos) at TC = 25°C
10
10 (*)
A
ID
Drain Current (continuos) at TC = 100°C
6.3
6.3 (*)
A
IDM 1)
Drain Current (pulsed)
40
40 (*)
A
PTOT
Total Dissipation at TC = 25°C
160
60
W
Derating Factor
1.28
0.48
W/°C
dv/dt (1)
Peak Diode Recovery voltage slope
3.5
V/ns
VISO
Insulation Withstand Voltage (DC)
- 4000
V
Tstg
Storage Temperature
55 to 150
°C
Tj
Max. Operating Junction Temperature
150
°C
STW10NC60 Typical Application
HIGH CURRENT, HIGH SPEED SWITCHING SWITH MODE POWER SUPPLIES (SMPS) DC-AC CONVERTERS FOR WELDING EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVER
STW10NC70Z General Description
The third generation of MESH OVERLAY™ Power MOSFETs for very high voltage exhibits unsurpassed on-resistance per unit area while integrating back-to-back Zener diodes between gate and source. Such arrangement gives extra ESD capability with higher ruggedness performance as requested by a large variety of single-switch applications.
STW10NC70Z Maximum Ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source Voltage (VGS = 0)
700
V
VDGR
Drain- gate Voltage (RGS = 20 k)
700
V
VGS
Gate-source Voltage
±25
V
ID
Drain Current (continuous) at Tc = 25
10.6
A
ID
Drain Current (continuous) at Tc = 100
6.7
A
IDM(•)
Drain Current (pulsed)
42
A
PTOT
Total Dissipation at Tc = 25
190
W
Derating Factor
1.51
W/
IGS
Gate-source Current (*)
±50
mA
VESD(G-S)
Gate source ESD(HBM-C=100pF, R=15K)
4
KV
dv/dt(1)
Peak Diode Recovery voltage slope
3
V/ns
Tstg
Storage Temperature
-65 to 150
Tj
Max. Operating Junction Temperature
150
(•)Pulse width limited by safe operating area (1)ISD 10.6A, di/dt 100A/µs, VDD V(BR)DSS, TjTJMAX. (*)Limited only by maximum temperature allowed
STW10NC70Z Typical Application
·SINGLE-ENDED SMPS IN MONITORS,COMPUTER AND INDUSTRIAL APPLICATION ·WELDING EQUIPMENT
The SuperMESH™ series is obtained through an extreme optimization of ST's well established stripbased PowerMESH™ layout. In addition to pushing on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the most demanding applications. Such series complements ST full range of high voltage MOSFETs including revolutionary MDmesh™ products.
STW10NK60Z Maximum Ratings
Symbol
Parameter
Value
Unit
TO-220/ D2PAK/I2PAK
TO-220FP
TO-247
VDS
Drain-source Voltage (VGS = 0)
600
V
VDGR
Drain-gate Voltage (RGS = 20 k)
600
V
VGS
Gate- source Voltage
± 30
V
ID
Drain Current (continuos) at TC = 25
10
10(*)
10
A
ID
Drain Current (continuos) at TC = 100
5.7
5.7(*)
5.7
A
IDM()
Drain Current (pulsed)
36
36(*)
36
A
Ptot
Total Dissipation at TC = 25
115
35
156
W
Derating Factor
0.92
0.28
1.25
W/
VESD(G-S)
Gate source ESD(HBM-C=100pF, R=1.5K)
4000
V
dv/dt (1)
Peak Diode Recovery voltage slope
4.5
V/ns
VISO
Insulation Withstand Voltage (DC)
-
2500
-
V
Tj Tstg
Operating Junction Temperature Storage Temperature
55 to 150
() Pulse width limited by safe operating area (1) ISD 10 A, di/dt 200A/s, VDD V(BR)DSS, Tj TJMAX.
STW10NK60Z Features
` TYPICAL RDS(on) = 0.65 ` EXTREMELY HIGH dv/dt CAPABILITY ` 100% AVALANCHE TESTED ` GATE CHARGE MINIMIZED ` VERY LOW INTRINSIC CAPACITANCES ` VERY GOOD MANUFACTURING REPEATIBILITY
STW10NK60Z Typical Application
· HIGH CURRENT, HIGH SPEED SWITCHING · IDEAL FOR OFF-LINE POWER SUPPLIES, ADAPTORS AND PFC · LIGHTING