Application·SINGLE-ENDED SMPS IN MONITORS,COMPUTER AND INDUSTRIAL APPLICATION·WELDING EQUIPMENTSpecifications Symbol Parameter Value Unit VDS Drain-source Voltage (VGS = 0) 700 V VDGR Drain- gate Voltage (RGS = 20 k) 700 V VGS Gate-source Voltage ±25 V ID Dra...
STW10NC70Z: Application·SINGLE-ENDED SMPS IN MONITORS,COMPUTER AND INDUSTRIAL APPLICATION·WELDING EQUIPMENTSpecifications Symbol Parameter Value Unit VDS Drain-source Voltage (VGS = 0) 700 V ...
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Symbol | Parameter | Value | Unit |
VDS |
Drain-source Voltage (VGS = 0) |
700 | V |
VDGR |
Drain- gate Voltage (RGS = 20 k) |
700 | V |
VGS |
Gate-source Voltage |
±25 | V |
ID |
Drain Current (continuous) at Tc = 25 |
10.6 | A |
ID |
Drain Current (continuous) at Tc = 100 |
6.7 | A |
IDM(•) |
Drain Current (pulsed) |
42 | A |
PTOT |
Total Dissipation at Tc = 25 |
190 | W |
Derating Factor |
1.51 | W/ | |
IGS |
Gate-source Current (*) |
±50 |
mA |
VESD(G-S) |
Gate source ESD(HBM-C=100pF, R=15K) |
4 |
KV |
dv/dt(1) |
Peak Diode Recovery voltage slope |
3 |
V/ns |
Tstg |
Storage Temperature |
-65 to 150 | |
Tj |
Max. Operating Junction Temperature |
150 |
The STW10NC70Z third generation of MESH OVERLAY™ Power MOSFETs for very high voltage exhibits unsurpassed on-resistance per unit area while integrating back-to-back Zener diodes between gate and source. Such arrangement gives extra ESD capability with higher ruggedness performance as requested by a large variety of single-switch applications.