IRH9150, IRH9230, IRH9250 Selling Leads, Datasheet
MFG:IR Package Cooled:TO-204AE D/C:05+
IRH9150, IRH9230, IRH9250 Datasheet download
Part Number: IRH9150
MFG: IR
Package Cooled: TO-204AE
D/C: 05+
MFG:IR Package Cooled:TO-204AE D/C:05+
IRH9150, IRH9230, IRH9250 Datasheet download
MFG: IR
Package Cooled: TO-204AE
D/C: 05+
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Datasheet: IRH9150
File Size: 124721 KB
Manufacturer: IRF [International Rectifier]
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PDF/DataSheet Download
Datasheet: IRH9230
File Size: 158475 KB
Manufacturer: IRF [International Rectifier]
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PDF/DataSheet Download
Datasheet: IRH9250
File Size: 167744 KB
Manufacturer: IRF [International Rectifier]
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International Rectifier's RADHard HEXFET® technology provides high performance power MOSFETs for space applications. This technology has over a decade of proven performance and reliability in satellite applications. These devices have been characterized for both Total Dose and Single Event Effects (SEE). The combination of low Rdson and low gate charge reduces the power losses in switching applications such as DC to DC converters and motor control. These devices retain all of the well established advantages of MOSFETs such as voltage control, fast switching, ease of paralleling and temperature stability of electrical parameters.
Parameter | Units | ||
ID @ VGS = 12V, TC = 25 | Continuous Drain Current | -22 | A |
ID @ VGS = 12V, TC = 100 | Continuous Drain Current | -14 | |
IDM | Pulsed Drain Current | -88 | |
PD @ TC = 25 | Max. Power Dissipation | 150 | W |
Linear Derating Factor | 1.2 | W/ | |
VGS | Gate-to-Source Voltage | ±20 | V |
EAS | Single Pulse Avalanche Energy | 500 | mJ |
IAR | Avalanche Current | -22 | A |
EAR | Repetitive Avalanche Energy | 1.5 | mJ |
dv/dt | Peak Diode Recovery dv/dt | -23 | V/ns |
TJ TSTG |
Operating Junction Storage Temperature Range |
-55 to 150 | |
Lead Temperature | 300 (0.063 in./1.6mm from case for 10s) | ||
Weight | 11.5 (Typical) | g |
International Rectifier's P-Channel RAD HARD technology HEXFETs demonstrate excellent threshold voltage stability and breakdown voltage stability at total radiation doses as high as 105 Rads (Si). Under identical pre- and post-radiation test conditions, International Rectifier's P-Channel RAD HARD HEXFETs retain identical electrical specifications up to 1 x 105 Rads (Si) total dose. No compensation in gate drive circuitry is required. These devices are also capable of surviving transient ionization pulses as high as 1 x 1012 Rads (Si)/Sec, and return to normal operation within a few microseconds. Single Event Effect (SEE) testing of International Rectifier P-Channel RAD HARD HEXFETs hasdemonstrated virtual immunity to SEE failure. Since the PChannel RAD HARD process utilizes International Rectifier's patented HEXFET technology, the user can expect the highest quality and reliability in the industry.
P-Channel RAD HARD HEXFET transistors also feature all of the well-established advantages of MOSFETs, such as voltage control,very fast switching, ease of paralleling and temperature stability of the electrical parameters.
They are well-suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers and high-energy pulse circuits in space and weapons environments.
Parameter | IRH9230 | Units | |
ID @ VGS = -12V, TC = 25V | Continuous Drain Current | -6.5 | A |
ID @ VGS = -12V, TC = 100 | Continuous Drain Current | -4.1 | |
IDM | Pulsed Drain Current | -26 | |
PD @ TC = 25 | Max. Power Dissipation | 75 | W |
Linear Derating Factor | 0.2 | W/K | |
VGS | Gate-to-Source Voltage | ±20 | V |
EAS | Single Pulse Avalanche Energy | 330 | mJ |
IAR | Avalanche Current | -6.5 | A |
EAR | Repetitive Avalanche Energy | 7.5 | mJ |
dv/dt | Peak Diode Recovery dv/dt | -5.5 | V/ns |
TJ TSTG |
Operating Junction Storage Temperature Range |
-55 to 150 | |
Package Mounting Surface Temperature | 300 (0.063 in. (1 .6mm) from case for 10s) | ||
Weight | 11.5 (Typical) | g |
International Rectifier's P-Channel RAD HARD technology HEXFETs demonstrate excellent threshold voltage stability and breakdown voltage stability at total radiation doses as high as 105 Rads (Si). Under identical pre- and postradiation test conditions, International Rectifier's P-Channel RAD HARD HEXFETs retain identical electrical specifications up to 1 x 105 Rads (Si) total dose. No compensation in gate drive circuitry is required. These devices are also capable of surviving transient ionization pulses as high as 1 x 1012 Rads (Si)/Sec, and return to normal operation within a few microseconds. Single Event Effect (SEE) testing of International Rectifier P-Channel RAD HARD HEXFETs has demonstrated virtual immunity to SEE failure. Since the PChannel RAD HARD process utilizes International Rectifier's patented HEXFET technology, the user can expect the highest quality and reliability in the industry.
P-Channel RAD HARD HEXFET transistors also feature all of the well-established advantages of MOSFETs, such as voltage control,very fast switching, ease of paralleling and temperature stability of the electrical parameters.
They are well-suited for applications such as switching power supplies, motor controls, inver ters, choppers, audio amplifiers and high-energy pulse circuits in space and weapons environments.
Parameter | IRH9250 | Units | |
ID @ VGS = 12V, TC = 25V | Continuous Drain Current | -14 | A |
ID @ VGS = 12V, TC = 100 | Continuous Drain Current | -9 | |
IDM | Pulsed Drain Current | -56 | |
PD @ TC = 25 | Max. Power Dissipation | 150 | W |
Linear Derating Factor | 1.2 | W/K | |
VGS | Gate-to-Source Voltage | ±20 | V |
EAS | Single Pulse Avalanche Energy | 500 | mJ |
IAR | Avalanche Current | -14 | A |
EAR | Repetitive Avalanche Energy | 15 | mJ |
dv/dt | Peak Diode Recovery dv/dt | -5.5 | V/ns |
TJ TSTG |
Operating Junction Storage Temperature Range |
-55 to 150 | |
Package Mounting Surface Temperature | 300 (0.063 in. (1 .6mm) from case for 10s) | ||
Weight | 11.5 (Typical) | g |