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Combining Fairchild's advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ299P minimizes both PCB space and RDS(ON) . This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, and low RDS(ON) .
FDZ299P Maximum Ratings
Symbol
Parameter
Ratings
Units
VDSS
Drain-Source Voltage
20
V
VGSS
Gate-Source Voltage
±12
V
ID
Drain Current Continuous (Note 1a) Pulsed
-4.6
A
10
PD
Power Dissipation (Steady State) (Note 1a)
1.7
W
TJ, TSTG
Operating and Storage Junction Temperature Range
-55 to +150
°C
FDZ299P Features
* 4.6 A, 20 V RDS(ON) = 55 m @ VGS = 4.5 V RDS(ON) = 80 m @ VGS = 2.5 V * Occupies only 2.25 mm2 of PCB area. Less than 50% of the area of a SSOT-6 * Ultra-thin package: less than 0.80 mm height when mounted to PCB * Outstanding thermal transfer characteristics: 4 times better than SSOT-6 * Ultra-low Qg x RDS(ON) figure-of-merit * High power and current handling capability.