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FDZ298N, FDZ391P, FDZ5047

Table of contents:
Info of FDZ298N
Info of FDZ391P
Info of FDZ5047

FDZ298N, FDZ391P, FDZ5047 Selling Leads, Datasheet

MFG:Fairchild Semiconductor Category:Discrete Semiconductor Products Package Cooled:2006+ D/C:39000

FDZ298N, FDZ391P, FDZ5047 Datasheet download

Five Points

Part Number: FDZ391P

Category: Discrete Semiconductor Products

MFG: Fairchild Semiconductor

Package Cooled: 2006+

D/C: 39000

Description: MOSFET P-CH 20V 3A 6-WLCSP

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FDZ298N Parameters

Technical/Catalog Information	FDZ298N
Vendor	Fairchild Semiconductor
Category	Discrete Semiconductor Products
Mounting Type	Surface Mount
FET Polarity	N-Channel
Drain to Source Voltage (Vdss)	20V
Current - Continuous Drain (Id) @ 25° C	6A
Rds On (Max) @ Id, Vgs	27 mOhm @ 6A, 4.5V
Input Capacitance (Ciss) @ Vds	680pF @ 10V
Power - Max	1.7W
Packaging	Tape & Reel (TR)
Gate Charge (Qg) @ Vgs	10nC @ 4.5V
Package / Case	BGA
FET Feature	Logic Level Gate
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	FDZ298N FDZ298N

FDZ298N General Description

Combining Fairchild's advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ298N minimizes both PCB space and R_DS(ON) . This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, and low R_DS(ON) .

FDZ298N Maximum Ratings

Symbol	Parameter	Ratings	Units
V_DSS	Drain-Source Voltage	20	V
V_GSS	Gate-Source Voltage	±12	V
I_D	Drain Current Continuous (Note 1a) Pulsed	6	A
I_D	Drain Current Continuous (Note 1a) Pulsed	10	A
P_D	Power Dissipation (Steady State) (Note 1a)	1.7	W
T_J, T_STG	Operating and Storage Junction Temperature Range	-55 to +150	°C

FDZ298N Features

* 6 A, 20 V R_DS(ON) = 27 m @ V_GS = 4.5 V R_DS(ON) = 39 m @ V_GS = 2.5 V
* Occupies only 2.25 mm² of PCB area. Less than 50% of the area of a SSOT-6
* Ultra-thin package: less than 0.80 mm height whemounted to PCB
* Outstanding thermal transfer characteristics: 4 times better than SSOT-6
* Ultra-low Q_g x R_DS(ON) figure-of-merit
* High power and current handling capability.

FDZ298N Typical Application

* Battery management
* Battery protection

FDZ391P Parameters

Technical/Catalog Information	FDZ391P
Vendor	Fairchild Semiconductor
Category	Discrete Semiconductor Products
Mounting Type	Surface Mount
FET Polarity	P-Channel
Drain to Source Voltage (Vdss)	20V
Current - Continuous Drain (Id) @ 25° C	3A
Rds On (Max) @ Id, Vgs	85 mOhm @ 1A, 4.5V
Input Capacitance (Ciss) @ Vds	1065pF @ 10V
Power - Max	900mW
Packaging	Tape & Reel (TR)
Gate Charge (Qg) @ Vgs	13nC @ 4.5V
Package / Case	6-WLCSP
FET Feature	Logic Level Gate
Drawing Number	*
Lead Free Status	Lead Free
RoHS Status	RoHS Compliant
Other Names	FDZ391P FDZ391P FDZ391PTR ND FDZ391PTRND FDZ391PTR

FDZ391P General Description

Designed on Fairchild's advanced 1.5 V PowerTrench processwith state of the art "low pitch" Thin WLCSP packaging process,the FDZ391P minimizes both PCB space and R_DS(on). Thisadvanced WLCSP MOSFET embodies a breakthrough inpackaging technology which enables the device to combineexcellent thermal transfer characteristics, ultra-low profilepackaging, low gate charge, and low R_DS(on).

FDZ391P Maximum Ratings

Product	Product status	Eco Status	Pricing*	Package type	Leads	Packing method	Package Drawing	Package Marking Convention**
FDZ391P	Full Production	RoHS Compliant	$0.42	1.0x1.5 WL-CSP	6	TAPE REEL		Line 1: &Y (Binary Calendar Year Coding) Line 2: &E6&G Line 3: &.

* Fairchild 1,000 piece Budgetary Pricing

** A sample button will appear if the part is available through Fairchild's on-line samples program. If there is no sample button, please contact a Fairchild distributor to obtain samples

Package marking information for product FDZ391P is available. Click here for more information .

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