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The MSM5116400B is a 4,194,304-word × 4-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM5116400B achieves high integration, high-speed operation, and low-power consumption because Oki manufacture...
Mfg:11000 Pack:OKI Vendor:Other Category:Other
The MSM5116165D/DSL is a 1,048,576-word × 16-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM5116165D/DSL achieves high integration, high-speed operation, and low-power consumption because Oki ma...
Vendor:Other Category:Other
The MSM5116160F is a 1,048,576-word * 16-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM5116160F achieves high integration, high-speed operation, and low-power consumption because Oki manufactur...
Vendor:Other Category:Other
The MSM5116160DSL is a 1,048,576-word*16-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM5116160D/DSL achieves high integration, high-speed operation, and ow-power consumption because Oki manufac...
Mfg:11000 Pack:OKI Vendor:Other Category:Other
The MSM5116160D/DSL is a 1,048,576-word*16-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM5116160D/DSL achieves high integration, high-speed operation, and ow-power consumption because Oki manuf...
Mfg:11000 Pack:OKI Vendor:Other Category:Other
The MSM511000C/CL is a 1,048,576-word × 1-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM511000C/CL achieves high integration, high-speed operation, and low-power consumption because Oki manufac...
Vendor:Other Category:Other
At QUALCOMM CDMA Technologies (QCT), we strive to constantly improve the indispensable communication tools we all use every day. QCT creates state-of-the-art chipsets, system software, development tools and products - su...
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OKI's 0.8m ASIC products MSM38S0000, specially designed for mixed 3-V/5-V applications, are now available in both Sea Of Gates (SOG) and Customer Structured Array (CSA) architectures. Both the SOG-based MSM38S Series and...
Mfg:OKI Vendor:Other Category:Other
The MSM27V1655CZ is a 16Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 524,288 double word x 32bit and 1,048,576word x 16bit. The MSM27V1655CZ oper...
Vendor:Other Category:Other
The MSM27C852CZ is a 8Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 524,288 word x 16bit and 1,048,576 word x 8bit. The MSM27C852CZ operates on a ...
Vendor:Other Category:Other
The MSM27C802CZ is a 8Mbit electrically Programmable Read-Only Memory whose configuration can be electrically switched between 524,288 word x 16bit and 1,048,576 word x 8bit. The MSM27 C802CZ operates on a single +5V pow...
Vendor:Other Category:Other
The MSM27C452CZ is a 4Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 262,144 word x 16bit and 524,288 word x 8bit. The MSM27C452CZ operates on a si...
Vendor:Other Category:Other
The MSM27C402CZ is a 4Mbit electrically Programmable Read-Only Memory whose configuration can be electrically switched between 262,144 word x 16bit and 524,288 word x 8bit. The MSM27C40 2CZ operates on a single +3.3V - 5...
Mfg:OKI D/C:07/08+ Vendor:Other Category:Other
The MSM27C401CZ is a 4Mbit electrically Programmable Read-Only Memory organized as 524,288 word x 8bit. The MSM27C401CZ operates on a single +3V-5V power supply and is TTL compatible. Since the MSM27C401CZ operates asyn...
Vendor:Other Category:Other
The MSM27C3255CZ is a 32Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 1,048,576 double word x 32bit and 2,097,152 word x 16bit. The MSM27C3255CZ op...
Vendor:Other Category:Other
The MSM27C3252CZ is a 32Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 2,097,152 word x 16bit and 4,194,304 word x 8bit. The MSM27C3252CZ operates ...
Mfg:OKI Pack:SOP-44 D/C:03+ Vendor:Other Category:Other
The MSM27C3202CZ is a 32Mbit electrically Programmable Read-Only Memory whose configuration can be electrically switched between 2,097,152 word x 16bit and 4,194,304 word x 8 bit. The MSM27C3202CZ operates on a single +5...
Vendor:Other Category:Other
The MSM27C1655CZ is a 16Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 524,288 double word x 32bit and 1,048,576 word x 16bit. The MSM27C1655CZ op...
Vendor:Other Category:Other
The MSM27C1652CZ is a 16Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 1,048,576 word x 16bit and 2,097,152 word x 8bit. The MSM27C1652CZ operates ...
Mfg:OKI Pack:SOP D/C:99 Vendor:Other Category:Other
The MSM27C1602CZ is a 16Mbit electrically Programmable Read-Only Memory whose configuration can be electrically switched between 1,048,576 word x 16bit and 2,097,152 word x 8 bit. The MSM27C1602CZ operates on a single +5...
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MSM10S00000.8mmCMOS2(SOG) .
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The MSM01 is an LSI device developed for portable, handsfree communication with built-in line echo canceler, acoustic echo canceler, and transmission signal noise canceler. Built-in to the voice signal interface is a lin...
Vendor:Other Category:Other
The MSM 7564-01 is a highly integrated single-chip modem IC which provides the functions needed to construct 14.4 kbps full-duplex and half-duplexmodems. This device is compliant with the following data communication for...
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The MSL-854UYL is designed based on an industry standard package for ease of handing and use.The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-854UOL is designed based on an industry standard package for ease of handing and use.The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-854UG is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-854TG is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-854SO is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-854SG is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-854HG is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-854BV is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-854BG is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-854B is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Mfg:UNITYOPTO D/C:07+ Vendor:Other Category:Other
The MSL-824UYL is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Mfg:UNITYOPTO D/C:07+ Vendor:Other Category:Other
The MSL-824UOL is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Mfg:UNITYOPTO D/C:07+ Vendor:Other Category:Other
The MSL-824UG is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Mfg:UNITYOPTO D/C:07+ Vendor:Other Category:Other
The MSL-824TG is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-824SYG is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Mfg:UNITYOPTO D/C:07+ Vendor:Other Category:Other
The MSL-824SG is designed based on in an industry tandard package for ease of handing and use.The package is water clear epoxy within white plastic.
Mfg:UNITYOPTO D/C:07+ Vendor:Other Category:Other
The MSL-824MW, a white source color device, is made with advanced InGaN on SiC chip.The package is mixing epoxy and phosphor ithin white plastic.
Vendor:Other Category:Other
The MSL-824HG-G is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-824HG1 is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Mfg:UNITYOPTO D/C:07+ Vendor:Other Category:Other
The MSL-824HG is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-824BV is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Vendor:Other Category:Other
The MSL-824BG is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Mfg:UNITYOPTO D/C:07+ Vendor:Other Category:Other
The MSL-824B is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-194Y, a YELLOW source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaAsP on GaP LED chip technology nd water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-194UYL, a AMBER source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
Vendor:Other Category:Other
The MSL-194UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-194UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-194UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-194TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-194SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.
Vendor:Other Category:Other
The MSL-194SG, a SIGNAL GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-194HR, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-194HG, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-194G, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-194DR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on GaAs LED chip technology and water clear epoxy package.
Vendor:Other Category:Other
The MSL-194BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on SiC LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-194B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-174Y, a YELLOW source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-174UYL, a AMBER source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
Vendor:Other Category:Other
The MSL-174UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-174UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-174UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-174TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes InGaN on SiC LED chip technology and ater clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-174SO, a ORANGE source Chip ED device, is designed in an indnstry tandard package suitable for SMT assembly ethod. It utilizes GaAsP on GaP LED chip echnology and water clear epoxy package.
Vendor:Other Category:Other
The MSL-174SG, a SIGNAL GREEN source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes InGaN on SiC LED chip technology and ater clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-174HR, a ORANGE source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaAsP on GaP LED chip technology nd water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-174HG, a GREEN source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaP on GaP LED chip technology nd water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-174G, a GREEN source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaP on GaP LED chip technology nd water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-174DR, a RED source Chip LED device, s designed in an indnstry standard package suitable or SMT assembly method. It utilizes AlGaAs on aAs LED chip technology and water clear epoxy ackage.
Vendor:Other Category:Other
The MSL-174BV, a BLUE source Chip LED device,is designed in an indnstry standard package suitable or SMT assembly method. It utilizes GaN on SiC ED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-174B, a BLUE source Chip LED device, s designed in an indnstry standard package suitable or SMT assembly method. It utilizes InGaN on SiC ED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-157RGB , a full colors device, is made with nGaN ( on Sapphire substrate) BLUE, TRUE GREEN and AlInGaP OFT RED LED dice. It is PCB type package, suitable for all MT assembly methods.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-154Y, a YELLOW source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaAsP on GaP LED chip technology nd water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-154UYL, a AMBER source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes AlGaInP on GaAs LED chip technology nd water clear epoxy package.
Vendor:Other Category:Other
The MSL-154UR, a RED source Chip LED device, s designed in an indnstry standard package suitable or SMT assembly method. It utilizes AlGaAs on lGaAs LED chip technology and water clear epoxy ackage.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-154UOL, a SUPER ORANGE source hip LED device, is designed in an indnstry tandard package suitable for SMT assembly ethod. It utilizes AlGaInP on GaAs LED chip echnology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-154UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-154TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-154SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.
Vendor:Other Category:Other
The MSL-154SG, a SIGNAL GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-154HR, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-154HG, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-154G, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-154DR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on GaAs LED chip technology and water clear epoxy package.
Vendor:Other Category:Other
The MSL-154BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on SiC LED chip technology and water clear epoxy package.
Mfg:. Pack:. D/C:07+ Vendor:Other Category:Other
The MSL-154B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.
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Features of the MSKB250 are:(1)plastic case with screw terminals;(2)high blocking voltage.
The absolute maximum ratings of the MSKB250 can be summarized as:(1):the symbol is ID,the value is 2,the unit is A;(2):the symbo...
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The MSK611 is a high voltage ultra high slew rate amplifier designed to provide large voltage swings in wideband systems. The true inverting op-amp topology employed in the MSK 611 provides excellent D.C. specifications ...
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