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Position: Home > SiteMap > Index M > Page 830

Index M : MSM5116400B,MSM5116165D,MSK5825-2.5RH,

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  • MSM5116400B

    Vendor:Other    Category:Other    
    The MSM5116400B is a 4,194,304-word × 4-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM5116400B achieves high integration, high-speed operation, and low-power consumption because Oki manufacture...

  • MSM5116165D

    Mfg:11000    Pack:OKI    Vendor:Other    Category:Other    
    The MSM5116165D/DSL is a 1,048,576-word × 16-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM5116165D/DSL achieves high integration, high-speed operation, and low-power consumption because Oki ma...

  • MSM5116160F

    Vendor:Other    Category:Other    
    The MSM5116160F is a 1,048,576-word * 16-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM5116160F achieves high integration, high-speed operation, and low-power consumption because Oki manufactur...

  • MSM5116160DSL

    Vendor:Other    Category:Other    
    The MSM5116160DSL is a 1,048,576-word*16-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM5116160D/DSL achieves high integration, high-speed operation, and ow-power consumption because Oki manufac...

  • MSM5116160D

    Mfg:11000    Pack:OKI    Vendor:Other    Category:Other    
    The MSM5116160D/DSL is a 1,048,576-word*16-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM5116160D/DSL achieves high integration, high-speed operation, and ow-power consumption because Oki manuf...

  • MSM511000C

    Mfg:11000    Pack:OKI    Vendor:Other    Category:Other    
    The MSM511000C/CL is a 1,048,576-word × 1-bit dynamic RAM fabricated in Oki's silicon-gate CMOS technology. The MSM511000C/CL achieves high integration, high-speed operation, and low-power consumption because Oki manufac...

  • MSM5100™

    Vendor:Other    Category:Other    
    At QUALCOMM CDMA Technologies (QCT), we strive to constantly improve the indispensable communication tools we all use every day. QCT creates state-of-the-art chipsets, system software, development tools and products - su...

  • MSM38S0000

    Vendor:Other    Category:Other    
    OKI's 0.8m ASIC products MSM38S0000, specially designed for mixed 3-V/5-V applications, are now available in both Sea Of Gates (SOG) and Customer Structured Array (CSA) architectures. Both the SOG-based MSM38S Series and...

  • MSM27V1655CZ

    Mfg:OKI    Vendor:Other    Category:Other    
    The MSM27V1655CZ is a 16Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 524,288 double word x 32bit and 1,048,576word x 16bit. The MSM27V1655CZ oper...

  • MSM27C852CZ

    Vendor:Other    Category:Other    
    The MSM27C852CZ is a 8Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 524,288 word x 16bit and 1,048,576 word x 8bit. The MSM27C852CZ operates on a ...

  • MSM27C802CZ

    Vendor:Other    Category:Other    
    The MSM27C802CZ is a 8Mbit electrically Programmable Read-Only Memory whose configuration can be electrically switched between 524,288 word x 16bit and 1,048,576 word x 8bit. The MSM27 C802CZ operates on a single +5V pow...

  • MSM27C452CZ

    Vendor:Other    Category:Other    
    The MSM27C452CZ is a 4Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 262,144 word x 16bit and 524,288 word x 8bit. The MSM27C452CZ operates on a si...

  • MSM27C402CZ

    Vendor:Other    Category:Other    
    The MSM27C402CZ is a 4Mbit electrically Programmable Read-Only Memory whose configuration can be electrically switched between 262,144 word x 16bit and 524,288 word x 8bit. The MSM27C40 2CZ operates on a single +3.3V - 5...

  • MSM27C401CZ

    Mfg:OKI    D/C:07/08+    Vendor:Other    Category:Other    
    The MSM27C401CZ is a 4Mbit electrically Programmable Read-Only Memory organized as 524,288 word x 8bit. The MSM27C401CZ operates on a single +3V-5V power supply and is TTL compatible. Since the MSM27C401CZ operates asyn...

  • MSM27C3255CZ

    Vendor:Other    Category:Other    
    The MSM27C3255CZ is a 32Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 1,048,576 double word x 32bit and 2,097,152 word x 16bit. The MSM27C3255CZ op...

  • MSM27C3252CZ

    Vendor:Other    Category:Other    
    The MSM27C3252CZ is a 32Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 2,097,152 word x 16bit and 4,194,304 word x 8bit. The MSM27C3252CZ operates ...

  • MSM27C3202CZ

    Mfg:OKI    Pack:SOP-44    D/C:03+    Vendor:Other    Category:Other    
    The MSM27C3202CZ is a 32Mbit electrically Programmable Read-Only Memory whose configuration can be electrically switched between 2,097,152 word x 16bit and 4,194,304 word x 8 bit. The MSM27C3202CZ operates on a single +5...

  • MSM27C1655CZ

    Vendor:Other    Category:Other    
    The MSM27C1655CZ is a 16Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 524,288 double word x 32bit and 1,048,576 word x 16bit. The MSM27C1655CZ op...

  • MSM27C1652CZ

    Vendor:Other    Category:Other    
    The MSM27C1652CZ is a 16Mbit electrically Programmable Read-Only Memory with page mode. Its configuration can be electrically switched between 1,048,576 word x 16bit and 2,097,152 word x 8bit. The MSM27C1652CZ operates ...

  • MSM27C1602CZ

    Mfg:OKI    Pack:SOP    D/C:99    Vendor:Other    Category:Other    
    The MSM27C1602CZ is a 16Mbit electrically Programmable Read-Only Memory whose configuration can be electrically switched between 1,048,576 word x 16bit and 2,097,152 word x 8 bit. The MSM27C1602CZ operates on a single +5...

  • MSM10S0000

    Vendor:Other    Category:Other    
    MSM10S00000.8mmCMOS2(SOG) .

  • MSM01

    Vendor:Other    Category:Other    
    The MSM01 is an LSI device developed for portable, handsfree communication with built-in line echo canceler, acoustic echo canceler, and transmission signal noise canceler. Built-in to the voice signal interface is a lin...

  • MSM 7564-01

    Vendor:Other    Category:Other    
    The MSM 7564-01 is a highly integrated single-chip modem IC which provides the functions needed to construct 14.4 kbps full-duplex and half-duplexmodems. This device is compliant with the following data communication for...

  • MSLU401

    Vendor:Other    Category:Other    

  • MSLU400

    Vendor:Other    Category:Other    

  • MSLU300

    Vendor:Other    Category:Other    

  • MSLU100

    Vendor:Other    Category:Other    

  • MSL-854UYL

    Vendor:Other    Category:Other    
    The MSL-854UYL is designed based on an industry standard package for ease of handing and use.The package is water clear epoxy within white plastic.

  • MSL-854UOL

    Vendor:Other    Category:Other    
    The MSL-854UOL is designed based on an industry standard package for ease of handing and use.The package is water clear epoxy within white plastic.

  • MSL-854UG

    Vendor:Other    Category:Other    
    The MSL-854UG is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-854TG

    Vendor:Other    Category:Other    
    The MSL-854TG is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-854SO

    Vendor:Other    Category:Other    
    The MSL-854SO is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-854SG

    Vendor:Other    Category:Other    
    The MSL-854SG is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-854HG

    Vendor:Other    Category:Other    
    The MSL-854HG is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-854BV

    Vendor:Other    Category:Other    
    The MSL-854BV is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-854BG

    Vendor:Other    Category:Other    
    The MSL-854BG is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-854B

    Vendor:Other    Category:Other    
    The MSL-854B is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-824UYL

    Mfg:UNITYOPTO    D/C:07+    Vendor:Other    Category:Other    
    The MSL-824UYL is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-824UOL

    Mfg:UNITYOPTO    D/C:07+    Vendor:Other    Category:Other    
    The MSL-824UOL is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-824UG

    Mfg:UNITYOPTO    D/C:07+    Vendor:Other    Category:Other    
    The MSL-824UG is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-824TG

    Mfg:UNITYOPTO    D/C:07+    Vendor:Other    Category:Other    
    The MSL-824TG is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-824SYG

    Vendor:Other    Category:Other    
    The MSL-824SYG is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-824SG

    Mfg:UNITYOPTO    D/C:07+    Vendor:Other    Category:Other    
    The MSL-824SG is designed based on in an industry tandard package for ease of handing and use.The package is water clear epoxy within white plastic.

  • MSL-824MW

    Mfg:UNITYOPTO    D/C:07+    Vendor:Other    Category:Other    
    The MSL-824MW, a white source color device, is made with advanced InGaN on SiC chip.The package is mixing epoxy and phosphor ithin white plastic.

  • MSL-824HG-G

    Vendor:Other    Category:Other    
    The MSL-824HG-G is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-824HG1

    Vendor:Other    Category:Other    
    The MSL-824HG1 is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-824HG

    Mfg:UNITYOPTO    D/C:07+    Vendor:Other    Category:Other    
    The MSL-824HG is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-824BV

    Vendor:Other    Category:Other    
    The MSL-824BV is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-824BG

    Vendor:Other    Category:Other    
    The MSL-824BG is designed based on in an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-824B

    Mfg:UNITYOPTO    D/C:07+    Vendor:Other    Category:Other    
    The MSL-824B is designed based on an industry standard package for ease of handing and use. The package is water clear epoxy within white plastic.

  • MSL-194Y

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-194Y, a YELLOW source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaAsP on GaP LED chip technology nd water clear epoxy package.

  • MSL-194UYL

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-194UYL, a AMBER source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-194UR

    Vendor:Other    Category:Other    
    The MSL-194UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package.

  • MSL-194UOL

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-194UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-194UG

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-194UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-194TG

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-194TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.

  • MSL-194SO

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-194SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.

  • MSL-194SG

    Vendor:Other    Category:Other    
    The MSL-194SG, a SIGNAL GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.

  • MSL-194HR

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-194HR, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.

  • MSL-194HG

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-194HG, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package.

  • MSL-194G

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-194G, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package.

  • MSL-194DR

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-194DR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on GaAs LED chip technology and water clear epoxy package.

  • MSL-194BV

    Vendor:Other    Category:Other    
    The MSL-194BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on SiC LED chip technology and water clear epoxy package.

  • MSL-194B

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-194B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.

  • MSL-174Y

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-174Y, a YELLOW source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.

  • MSL-174UYL

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-174UYL, a AMBER source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-174UR

    Vendor:Other    Category:Other    
    The MSL-174UR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on AlGaAs LED chip technology and water clear epoxy package.

  • MSL-174UOL

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-174UOL, a SUPER ORANGE source Chip LED device, is designed in an indnstry Standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-174UG

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-174UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-174TG

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-174TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes InGaN on SiC LED chip technology and ater clear epoxy package.

  • MSL-174SO

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-174SO, a ORANGE source Chip ED device, is designed in an indnstry tandard package suitable for SMT assembly ethod. It utilizes GaAsP on GaP LED chip echnology and water clear epoxy package.

  • MSL-174SG

    Vendor:Other    Category:Other    
    The MSL-174SG, a SIGNAL GREEN source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes InGaN on SiC LED chip technology and ater clear epoxy package.

  • MSL-174HR

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-174HR, a ORANGE source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaAsP on GaP LED chip technology nd water clear epoxy package.

  • MSL-174HG

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-174HG, a GREEN source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaP on GaP LED chip technology nd water clear epoxy package.

  • MSL-174G

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-174G, a GREEN source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaP on GaP LED chip technology nd water clear epoxy package.

  • MSL-174DR

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-174DR, a RED source Chip LED device, s designed in an indnstry standard package suitable or SMT assembly method. It utilizes AlGaAs on aAs LED chip technology and water clear epoxy ackage.

  • MSL-174BV

    Vendor:Other    Category:Other    
    The MSL-174BV, a BLUE source Chip LED device,is designed in an indnstry standard package suitable or SMT assembly method. It utilizes GaN on SiC ED chip technology and water clear epoxy package.

  • MSL-174B

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-174B, a BLUE source Chip LED device, s designed in an indnstry standard package suitable or SMT assembly method. It utilizes InGaN on SiC ED chip technology and water clear epoxy package.

  • MSL-157RGB

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-157RGB , a full colors device, is made with nGaN ( on Sapphire substrate) BLUE, TRUE GREEN and AlInGaP OFT RED LED dice. It is PCB type package, suitable for all MT assembly methods.

  • MSL-154Y

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-154Y, a YELLOW source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes GaAsP on GaP LED chip technology nd water clear epoxy package.

  • MSL-154UYL

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-154UYL, a AMBER source Chip ED device, is designed in an indnstry standard ackage suitable for SMT assembly method. It tilizes AlGaInP on GaAs LED chip technology nd water clear epoxy package.

  • MSL-154UR

    Vendor:Other    Category:Other    
    The MSL-154UR, a RED source Chip LED device, s designed in an indnstry standard package suitable or SMT assembly method. It utilizes AlGaAs on lGaAs LED chip technology and water clear epoxy ackage.

  • MSL-154UOL

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-154UOL, a SUPER ORANGE source hip LED device, is designed in an indnstry tandard package suitable for SMT assembly ethod. It utilizes AlGaInP on GaAs LED chip echnology and water clear epoxy package.

  • MSL-154UG

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-154UG, a YELLOW GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaInP on GaAs LED chip technology and water clear epoxy package.

  • MSL-154TG

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-154TG, a TRUE GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.

  • MSL-154SO

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-154SO, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.

  • MSL-154SG

    Vendor:Other    Category:Other    
    The MSL-154SG, a SIGNAL GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.

  • MSL-154HR

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-154HR, a ORANGE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaAsP on GaP LED chip technology and water clear epoxy package.

  • MSL-154HG

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-154HG, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package.

  • MSL-154G

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-154G, a GREEN source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaP on GaP LED chip technology and water clear epoxy package.

  • MSL-154DR

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-154DR, a RED source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes AlGaAs on GaAs LED chip technology and water clear epoxy package.

  • MSL-154BV

    Vendor:Other    Category:Other    
    The MSL-154BV, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes GaN on SiC LED chip technology and water clear epoxy package.

  • MSL-154B

    Mfg:.    Pack:.    D/C:07+    Vendor:Other    Category:Other    
    The MSL-154B, a BLUE source Chip LED device, is designed in an indnstry standard package suitable for SMT assembly method. It utilizes InGaN on SiC LED chip technology and water clear epoxy package.

  • MSKW3000

    Vendor:Other    Category:Other    

  • MSKW2000

    Vendor:Other    Category:Other    

  • MSKB250

    Vendor:Other    Category:Other    
    Features of the MSKB250 are:(1)plastic case with screw terminals;(2)high blocking voltage. The absolute maximum ratings of the MSKB250 can be summarized as:(1):the symbol is ID,the value is 2,the unit is A;(2):the symbo...

  • MSK611

    Vendor:Other    Category:Other    
    The MSK611 is a high voltage ultra high slew rate amplifier designed to provide large voltage swings in wideband systems. The true inverting op-amp topology employed in the MSK 611 provides excellent D.C. specifications ...

  • MSK5826RH

    Vendor:Other    Category:Other    

  • MSK5825-3.3RH

    Vendor:Other    Category:Other    

  • MSK5825-2.5RH

    Vendor:Other    Category:Other