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MSL-824UYL

Features: ·High performance · Excellent chip to chip consistency· High reliabilityApplication· LCD backlighting· Symbol backlighting· Front panel indicatorSpecifications Parameter Symbol Maximum Rating Unit Power Dissipation Pad 200 mW Continuous Forward Current I...

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SeekIC No. : 004428650 Detail

MSL-824UYL: Features: ·High performance · Excellent chip to chip consistency· High reliabilityApplication· LCD backlighting· Symbol backlighting· Front panel indicatorSpecifications Parameter Symbol ...

MSL-824UYL Data Sheet

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Part Number:
MSL-824UYL
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

·High performance
· Excellent chip to chip consistency
· High reliability


Application

· LCD backlighting
· Symbol backlighting
· Front panel indicator


Specifications

Parameter
Symbol
Maximum Rating
Unit
Power Dissipation
Pad
200
mW
Continuous Forward Current
Iaf
35
mA
Reverse Current(VR=5V)
IR
10
uA
Operating Temperature Range
Topr
-40 to +85
Storage Temperature Range
Tstg
-40 to +85
Lead Soldering Temperature 260 for 5 second (2.0mm From Body)



Description

The MSL-824UYL is designed based on  an industry  standard package for ease of handing and use.
The package is water clear  epoxy within white plastic.


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