Features: · High performance · Excellent chip to chip consistency· High reliabilityApplication· LCD backlighting· Symbol backlighting· Front panel indicatorSpecifications Parameter Symbol Maximum Rating Unit Power Dissipation Pad 100 mW Peak Forward Current (1/100 Du...
MSL-824HG1: Features: · High performance · Excellent chip to chip consistency· High reliabilityApplication· LCD backlighting· Symbol backlighting· Front panel indicatorSpecifications Parameter Symbol ...
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Parameter |
Symbol |
Maximum Rating |
Unit |
Power Dissipation |
Pad |
100 |
mW |
Peak Forward Current (1/100 Duty Cycle 1Khz pulse) |
Ipf |
120 |
mA |
Continuous Forward Current |
Iaf |
30 |
mA |
Reverse Current(VR=5V) |
IR |
100 |
vA |
Operating Temperature Range |
Topr |
-40 to +85 | |
Storage Temperature Range |
Tstg |
-40 to +85 | |
Lead Soldering Temperature 260 for 5 second (2.0mm From Body) |