Features: · High performance· Excellent chip to chip consistency· High reliabilityApplication· LCD backlighting· Symbol backlighting· Front panel indicatorSpecifications Parameter Symbol Maximum Rating Unit Power Dissipation Pad 100 mW Continuous Forward Current I...
MSL-824SG: Features: · High performance· Excellent chip to chip consistency· High reliabilityApplication· LCD backlighting· Symbol backlighting· Front panel indicatorSpecifications Parameter Symbol ...
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Parameter |
Symbol |
Maximum Rating |
Unit |
Power Dissipation |
Pad |
100 |
mW |
Continuous Forward Current |
Iaf |
25 |
mA |
Reverse Current(VR=5V) |
IR |
10 |
uA |
Operating Temperature Range |
Topr |
-40 to +85 | |
Storage Temperature Range |
Tstg |
-40 to +85 | |
Lead Soldering Temperature 260 for 5 second (2.0mm From Body) |