MSM38S0000

Features: • 0.8m drawn three-layer metal CMOS• Mixed 3-V/5-V operation for low power and high speed• SOG and CSA architecture availability• Clock tree cells with 1.0-ns clock skew, worst-case (fan-out = 2000 at 70 MHz)• Usable density from 6.5k to 135k gates• I/...

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MSM38S0000 Picture
SeekIC No. : 004428680 Detail

MSM38S0000: Features: • 0.8m drawn three-layer metal CMOS• Mixed 3-V/5-V operation for low power and high speed• SOG and CSA architecture availability• Clock tree cells with 1.0-ns clock...

floor Price/Ceiling Price

Part Number:
MSM38S0000
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/26

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Product Details

Description



Features:

• 0.8m drawn three-layer metal CMOS
• Mixed 3-V/5-V operation for low power and high speed
• SOG and CSA architecture availability
• Clock tree cells with 1.0-ns clock skew, worst-case (fan-out = 2000 at 70 MHz)
• Usable density from 6.5k to 135k gates
• I/Os may be VSS, 3 V, 5 V, VDD, CMOS, TTL, and 3- state, with 2-mA to 48-mA drive
• I/O level shifter cells, allowing any buffer (input, output, or bidirectional) to interface with 3 V or 5 V
• Slew-rate-controlled outputs for low radiated noise
• User-configurable single and multi-port memories
• Specialized 3-V and 5-V macrocells, including phaselocked loop, and PCI cells
• Floorplanning for front-end simulation and back-end layout controls
• JTAG boundary scan and scan-path ATVG



Specifications

Parameter
Symbol
Conditions [1]
Value
Unit
Power supply voltage
VDD
Tj = 25° C
VSS = 0 V
-0.5 to +6.5
V
Input voltage
VI
-0.5 to VDD+0.5
V
Output voltage
VO
-0.5 to VDD+0.5
V
Output current per I/O base cell
IO
-24 to + 24
mA
Current per power PAD
IPAD
-90 to +90
mA
Storage temperature
Tstg
-65 to +150
° C



Description

OKI's 0.8m ASIC products MSM38S0000, specially designed for mixed 3-V/5-V applications, are now available in both Sea Of Gates (SOG) and Customer Structured Array (CSA) architectures. Both the SOG-based MSM38S Series and the CSA-based MSM98S Series use a three-layer-metal process on 0.8m drawn (0.6m L-effective) CMOS technology. The semiconductor process is adapted from OKI's production-proven 16-Mbit DRAM manufacturing process.
Ideal for low-power portable applications, the MSM38S/98S are constructed with separate power busses for internal core logic and configurable I/O functions. Altogether, the architecture provides maximum flexibility, meeting the needs of all 3-V, 5-V, and mixed 3-V/5-V signal requirements.

The MSM38S0000 SOG Series is available in seven sizes with up to 420 I/O pads and over 135,000 usable gates. SOG array sizes are designed to fit the most popular quad flat pack (QFP) packages, such as 100-, 136-, 160-, and 208-pin QFPs. MSM38S SOG-based designs are therefore ideal for pad-limited circuits that require rapid prototyping turnaround times.

The MSM38S0000 CSA Series is an all-mask-level superset of the SOG series, available in 29 sizes. The CSA offerings combine the SOG architecture's logic flexibility with the higher integration yielded by optimized diffusion for faster and more compact memory blocks. The MSM98S is ideal for core-limited applications or circuits with large and/or multiple memory functions. Customer modification to the structure of any of the 29 predefined masterslices, rather than creation of a new masterslice every time, improves the prototyping turnaround time over cell-based manufacturing techniques.

Both product families are supported by OKI's proprietary MEMGEN tool which quickly and easily generates SOG memories (for the MSM38S) as well as optimized memories for the MSM38S0000 Series. The families also feature floorplanning to control pre-layout timing, clock-skew management software that guarantees worst-case clock skew of 1 ns or less, and scan-path design techniques that support ATVG for fault coverage approaching 100%.




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