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NDH853N, NDH854P, NDHV210AFA-S08

NDH853N, NDH854P, NDHV210AFA-S08 Selling Leads, Datasheet

MFG:7  Package Cooled:NS  D/C:09+

NDH853N, NDH854P, NDHV210AFA-S08 Picture

NDH853N, NDH854P, NDHV210AFA-S08 Datasheet download

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Part Number: NDH853N

 

MFG: 7

Package Cooled: NS

D/C: 09+

 

 

 
 
 
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About NDH853N

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Datasheet: NDH853N

File Size: 84638 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About NDH854P

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Datasheet: NDH854P

File Size: 87926 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About NDH8301N

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Datasheet: NDH8301N

File Size: 216852 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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NDH853N General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as battery powered circuits or portable electronics where fast switching, low in-line power loss, and resistance to transients are needed.

NDH853N Maximum Ratings

Symbol
Parameter
NDH853N
Units
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
30
±20
7.6
23
1.8
1
0.9
-55 to 150
V
V
A

W


°C
ID
Drain Current Continuous Pulsed (Note 1a)
PD
Maximum Power Dissipation (Note 1a)
(Note 1b)
(Note 1c)
TJ,TSTG Operating and Storage Temperature Range
THERMAL CHARACTERISTICS
RJA
RJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)

70
20

°C/W
°C/W

NDH853N Features

`7.6 A, 30 V. RDS(ON) = 0.017 @ VGS = 10 V  RDS(ON)  = 0.025 @ VGS = 4.5 V.
`High density cell design for extremely low RDS(ON)
`Proprietary SuperSOTTM-8 small outline surface mount
`package with high power and current handling capability.

NDH853N Connection Diagram

NDH854P General Description

SuperSOTTM-8 P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as notebook computer power management and other battery powered circuits where fast switching, low in-line power loss, and resistance to transients are needed.

NDH854P Maximum Ratings

Symbol
Parameter
NDH854P
Units
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
-30
±20
-5.1
-15
1.8
1
0.9
-55 to 150
V
V
A

W


°C
ID
Drain Current Continuous Pulsed (Note 1a)
PD
Maximum Power Dissipation (Note 1a)
(Note 1b)
(Note 1c)
TJ,TSTG Operating and Storage Temperature Range
THERMAL CHARACTERISTICS
</tab
RJA
RJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)

70
20

°C/W
°C/W

NDH854P Features

`-5.1 A, -30 V. RDS(ON) = 0.032  @ VGS = -10 V RDS(ON) = 0.052  @ VGS = -4.5V.
`Proprietary SuperSOTTM-8 package design using copper lead frame for superior thermal and electrical capabilities.
`High density cell design for extremely low RDS(ON).
`Exceptional on-resistance and maximum DC current capability.

NDH854P Connection Diagram

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