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NDH8321C, NDH8321L, NDH832P

NDH8321C, NDH8321L, NDH832P Selling Leads, Datasheet

MFG:Fairchild Semiconductor  Category:Discrete Semiconductor Products  Package Cooled:SOP-8  D/C:N/A

NDH8321C, NDH8321L, NDH832P Picture

NDH8321C, NDH8321L, NDH832P Datasheet download

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Part Number: NDH8321C

Category: Discrete Semiconductor Products

MFG: Fairchild Semiconductor

Package Cooled: SOP-8

D/C: N/A

Description: MOSFET P-CHAN 20V 4.2A SSOT8

 

 
 
 
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About NDH8321C

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Datasheet: NDH8321C

File Size: 257304 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About NDH8301N

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Datasheet: NDH8301N

File Size: 216852 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About NDH832P

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Datasheet: NDH832P

File Size: 84359 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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NDH8321C General Description

These dual N- and P -Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as notebook computer power management and other battery powered circuits where fast switching, low in-line power loss, and resistance to transients are needed.

NDH8321C Maximum Ratings

Symbol
Parameter

N-Channel

P-Channel

Units
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage - Continuous
20
±8
3.8
15
-20
±8
-2.7
-10
V
V
A

W

°C
ID
Drain Current Continuous Pulsed (Note 1)
PD
Power Dissipation for Single Operation (Note 1)
0.8
-55 to 150
TJ,TSTG Operating and Storage Junction Temperature Range
THERMAL CHARACTERISTICS
</T
RJA
RJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1)
(Note 1)

156
40

°C/W
°C/W

NDH8321C Features

`N-Ch 3.8 A, 20 V, RDS(ON)=0.035 @ VGS= 4.5 V RDS(ON)=0.045 W @ VGS=2.7 V P-Ch -2.7 A, -20V, RDS(ON)=0.07 @ VGS= -4.5 V RDS(ON) =0.095 @ VGS= -2.7 V.
`Proprietary SuperSOTTM-8 package design using copper lead frame for superior thermal and electrical capabilities.
`High density cell design for extremely low RDS(ON).
`Exceptional on-resistance and maximum DC current capability.

NDH8321C Connection Diagram

NDH832P Parameters

Technical/Catalog InformationNDH832P
VendorFairchild Semiconductor
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET PolarityP-Channel
Drain to Source Voltage (Vdss)20V
Current - Continuous Drain (Id) @ 25° C4.2A
Rds On (Max) @ Id, Vgs60 mOhm @ 4.2A, 4.5V
Input Capacitance (Ciss) @ Vds 1000pF @ 10V
Power - Max900mW
PackagingTape & Reel (TR)
Gate Charge (Qg) @ Vgs30nC @ 4.5V
Package / CaseSSOT-8
FET FeatureLogic Level Gate
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names NDH832P
NDH832P

NDH832P General Description

These P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as notebook computer power management and other battery powered circuits where fast switching, low in-line power loss, and resistance to transients are needed.

NDH832P Maximum Ratings

Symbol
Parameter
NDH832P
Units
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
-20
-8
-4.2
-15
1.8
1
0.9
-55 to 150
V
V
A

W


°C
ID
Drain Current Continuous Pulsed (Note 1a)
PD
Maximum Power Dissipation (Note 1a)
(Note 1b)
(Note 1c)
TJ,TSTG Operating and Storage Temperature Range
THERMAL CHARACTERISTICS
</tabl
RJA
RJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)

70
20

°C/W
°C/W

NDH832P Features

`-4.2A, -20V. RDS(ON) = 0.06 @ VGS = -4.5V RDS(ON) = 0.08 @ VGS = -2.7V.
`High density cell design for extremely low RDS(ON).
`Enhanced SuperSOTTM-8 small outline surface mount
`package with high power and current handling capability.

NDH832P Connection Diagram

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