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NDH8304P, NDH831N, NDH8320C

NDH8304P, NDH831N, NDH8320C Selling Leads, Datasheet

MFG:Fairchild Semiconductor  Category:Discrete Semiconductor Products  Package Cooled:n/a  D/C:98+

NDH8304P, NDH831N, NDH8320C Picture

NDH8304P, NDH831N, NDH8320C Datasheet download

Five Points

Part Number: NDH8304P

Category: Discrete Semiconductor Products

MFG: Fairchild Semiconductor

Package Cooled: n/a

D/C: 98+

Description: MOSFET P-CH DUAL 20V 2.7A SSOT8

 

 
 
 
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About NDH8304P

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Datasheet: NDH8304P

File Size: 72703 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About NDH831N

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Datasheet: NDH831N

File Size: 227209 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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About NDH8320C

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Datasheet: NDH8320C

File Size: 75946 KB

Manufacturer: FAIRCHILD [Fairchild Semiconductor]

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NDH8304P Parameters

Technical/Catalog InformationNDH8304P
VendorFairchild Semiconductor
CategoryDiscrete Semiconductor Products
Mounting TypeSurface Mount
FET Polarity2 P-Channel (Dual)
Drain to Source Voltage (Vdss)20V
Current - Continuous Drain (Id) @ 25° C2.7A
Rds On (Max) @ Id, Vgs70 mOhm @ 2.7A, 4.5V
Input Capacitance (Ciss) @ Vds 865pF @ 10V
Power - Max800mW
PackagingTape & Reel (TR)
Gate Charge (Qg) @ Vgs23nC @ 4.5V
Package / CaseSuperSOT-8
FET FeatureLogic Level Gate
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names NDH8304P
NDH8304P

NDH8304P General Description

SuperSOTTM-8 P-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance. These devices are particularly suited for low voltage applications such as notebook computer power management and other battery powered circuits where fast high-side switching, and low in-line power loss are needed in a very small outline surface mount package.

NDH8304P Maximum Ratings

Symbol
Parameter
NDH8304P
Units
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage - Continuous
-20
±8
-2.7
-10
0.8
-55 to 150
V
V
A
W

°C
ID
Drain Current Continuous Pulsed (Note 1)
PD
Maximum Power Dissipation (Note 1 )
TJ,TSTG Operating and Storage Temperature Range
THERMAL CHARACTERISTICS
RJA
RJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1)
(Note 1)

156
40

°C/W
°C/W

NDH8304P Features

· -2.7 A, -20 V. RDS(ON) = 0.07 W @ VGS = -4.5 V RDS(ON) = 0.095 W @ VGS = -2.7 V.
· Proprietary SuperSOTTM-8 package design using copper lead frame for superior thermal and electrical capabilities.
· High density cell design for extremely low RDS(ON).
· Exceptional on-resistance and maximum DC current capability.

NDH8304P Connection Diagram

NDH831N General Description

These N-Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as notebook computer power management and portable electronics where fast switching, low in-line power loss, and resistance to transients are needed.

NDH831N Maximum Ratings

Symbol
Parameter
NDH831N
Units
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage
20
8
5.8
20
1.8
1
0.9
-55 to 150
V
V
A
W

°C
ID
Drain Current Continuous Pulsed (Note 1a)
PD
Maximum Power Dissipation (Note 1a)
(Note 1b)
(Note 1c)
TJ,TSTG Operating and Storage Temperature Range
THERMAL CHARACTERISTICS
<td width="5
RJA
RJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1a)
(Note 1)

70
20

NDH831N Features

`5.8A, 20V. RDS(ON) = 0.03  @ VGS = 4.5V RDS(ON) = 0.04  @ VGS = 2.7V.
`High density cell design for extremely low RDS(ON).
`Enhanced SuperSOTTM-8 small outline surface mount
`package with high power and current handling capability.

NDH831N Connection Diagram

NDH8320C General Description

These dual N- and P -Channel enhancement mode power field effect transistors are produced using Fairchild's proprietary, high cell density, DMOS technology. This very high density process is especially tailored to minimize on-state resistance and provide superior switching performance. These devices are particularly suited for low voltage applications such as notebook computer power management and other battery powered circuits where fast switching, low in-line power loss, and resistance to transients are needed.

NDH8320C Maximum Ratings

Symbol
Parameter

N-Channel

P-Channel

Units
VDSS
VGSS
Drain-Source Voltage
Gate-Source Voltage - Continuous
20
8
3
15
-20
-8
-2
-10
V
V
A

W

°C
ID
Drain Current Continuous Pulsed (Note 1)
PD
Power Dissipation for Single Operation (Note 1)
0.8
-55 to 150
TJ,TSTG Operating and Storage Junction Temperature Range
THERMAL CHARACTERISTICS
RJA
RJC
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
(Note 1)
(Note 1)

156
40

°C/W
°C/W

NDH8320C Features

`N-Channel 3 A, 20 V, RDS(ON) =0.06 @ VGS=4.5 V RDS(ON) =0.075 @ VGS=2.7 V P-Channel -2A, -20V, RDS(ON) =0.13 @ VGS=-4.5 V RDS(ON)=0.19 @ VGS=-2.7 V.
`Proprietary SuperSOTTM-8 package design using copper lead frame for superior thermal and electrical capabilities.
`High density cell design for extremely low RDS(ON).
`Exceptional on-resistance and maximum DC current capability.

NDH8320C Connection Diagram

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