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MTY30N50, MTY30N50E, MTY32N25E/D

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MTY30N50, MTY30N50E, MTY32N25E/D Datasheet download

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Part Number: MTY30N50

 

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Package Cooled: TO-3P

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About MTY30N50

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Datasheet: MTY30N50

File Size: 243678 KB

Manufacturer: MOTOROLA [Motorola, Inc]

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About MTY30N50E

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Datasheet: MTY30N50E

File Size: 243678 KB

Manufacturer: MOTOROLA [Motorola, Inc]

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About MTY100N10E

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Datasheet: MTY100N10E

File Size: 221821 KB

Manufacturer: MOTOROLA [Motorola, Inc]

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MTY30N50 General Description

This advanced TMOS power FET is designed to withstand high energy in the avalanche and commutation modes. This new energy efficient design also offers a draintosource diode with fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters, PWM motor controls, and other inductive loads. The avalanche energy capability is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients.

MTY30N50 Maximum Ratings

Rating
Symbol
Value
Unit
DraintoSource Voltage
VDSS
500
Vdc
DraintoGate Voltage (RGS = 1.0 M)
VDGR
500
Vdc
GatetoSource Voltage - Continuous
- NonRepetitive(tp 10 ms)
VGS
VGSM
± 20
± 40
Vdc
Vpk
Drain Current
- Continuous @ Tc = 25°C
- Single Pulse (tp 10 s)
ID
IDM
30
80
Adc
Apk
Total Power Dissipation
Derate above 25°C
PD
300
2.38
Watts
W/°C
Operating and Storage Temperature Range
TJ, Tstg
55 to 150
°C
Single Pulse DraintoSource Avalanche Energy TJ = 25°C
(VDD =100Vdc,VGS = 10Vdc, Vdc,Peak IL =30 Apk, L =10 mH, RG = 25)
EAS
3000
mJ
Thermal Resistance
- Junction to Case
- Junction to Ambient
RJC
RJA
0.42
40
°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds
TL
260
°C
Designer's Data for "Worst Case" Conditions - The Designer's Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit
curves - representing boundaries on device characteristics - are given to facilitate "worst case" design.
EFET and Designer's are trademarks of Motorola, Inc.
TMOS is a registered trademark of Motorola, Inc.

MTY30N50 Features

• Avalanche Energy Specified
• Diode is Characterized for Use in Bridge Circuits
• IDSS and VDS(on) Specified at Elevated Temperature

MTY30N50E General Description

This advanced TMOS power FET is designed to withstand high energy in the avalanche and commutation modes. This new energy efficient design also offers a draintosource diode with fast recovery time. Designed for high voltage, high speed switching applications in power supplies, converters, PWM motor controls, and other inductive loads. The avalanche energy capability is specified to eliminate the guesswork in designs where inductive loads are switched and offer additional safety margin against unexpected voltage transients.

MTY30N50E Maximum Ratings

Rating Symbol Value Unit
DraintoSource Voltage VDSS 500 Vdc
DraintoGate Voltage (RGS = 1.0 MW) VDGR 500 Vdc
GatetoSource Voltage - Continuous
VGS
VGSM
± 20
± 40
Vdc
Vpk
Drain Current - Continuous @ TC = 25°C
Drain Current - Single Pulse (tp 10 s)


ID
IDM
30
80
Adc
Apk
Total Power Dissipation
Derate above 25°C

PD
300
2.38
Watts
Single Pulse DraintoSource Avalanche Energy - Starting TJ = 25°C
(VDD = 30 Vdc, VGS = 5.0 Vdc, Peak IL = 9.0 Apk, L = 5.0 mH, RG = 25)
EAS 300 mJ
Thermal Resistance - Junction to Case
Thermal Resistance - Junction to Ambient
RqJC
RqJA
0.42
40
°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8, from case for 10 seconds TL 260 °C
Operating and Storage Temperature Range TJ, Tstg 55 to 150 °C

MTY30N50E Features

• Avalanche Energy Specified
• Diode is Characterized for Use in Bridge Circuits
• IDSS and VDS(on) Specified at Elevated Temperature

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