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The IPS031G/IPS032G are fully protected single/dual low side SMART POWER MOSFETs that feature overcurrent, over-temperature, ESD protection and drain to source active clamp.These devices combine a HEXFET® POWER MOSFET and a gate driver. They offer full protection and high reliability required in harsh environments. The driver allows short switching times and provides efficient protection by turning off the power MOSFET when the temperature exceeds 165 or when the drain current reaches 12A. The device restarts once the input is cycled. The avalanche capability is significantly enhanced by the active clamp and covers most inductive load demagnetizations.
IPS031G Maximum Ratings
Symbol
Parameter
Min.
Max.
Units
Test Conditions
Vds
Maximum drain to source voltage
-
47
V
Vin
Maximum input voltage
-0.3
7
Iin, max
Maximum IN current
-10
+10
mA
Isd cont.
Diode max. continuous current (1) (rth=125/W) IPS031G (for all sd mosfets, rth=85/W) IPS032G
- -
1.4 2
Isd pulsed
Diode max. pulsed current (1) (for ea. mosfet)
-
15
Pd
Maximum power dissipation(1) (rth=125/W) IPS031G (for all Pd mosfets, rth=85/W) IPS032G
- -
1 1.5
W
ESD1
Electrostatic discharge voltage (Human Body)
-
4
kV
C=100pF, R=1500Ω,
ESD2
Electrostatic discharge voltage (Machine Model)
-
0.5
C=200pF, R=0Ω, L=10µH
T stor.
Max. storage temperature
-55
150
Tj max.
Max. junction temperature
-40
150
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are referenced to SOURCE lead. (TAmbient = 25 unless otherwise specified). PCB mounting uses the standard footprint with 70 µm copper thickness. All Sources leads of each mosfet must be connected together to get full current capability
IPS031G Features
• Over temperature shutdown • Over current shutdown • Active clamp • Low current & logic level input • E.S.D protection