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The IPS022G are fully protected dual low side SMART POWER MOSFETs respectively. They feature overcurrent, over-temperature, ESD protection and drain to source active clamp.These devices combine a HEXFET® POWER MOSFET and a gate driver. They offer full protection and high reliability required in harsh environments. The driver allows short switching times and provides efficient protection by turning OFF the power MOSFET when the temperature exceeds 165oC or when the drain current reaches 5A. These devices restart once the input is cycled. The avalanche capability is significantly enhanced by the active clamp and covers most inductive load demagnetizations.
IPS022G Maximum Ratings
Symbol
Parameter
Min.
Max.
Units
Test Conditions
Vds
Maximum drain to source voltage
-
47
V
Vin
Maximum input voltage
-0.3
7
Iin, max
Maximum IN current
-10
+10
mA
Isd cont.
Diode max. continuous current (1) ( lsd mosfets, rth=125oC/W)
-
1.4
Isd pulsed
Diode max. pulsed current (1) (for ea. mosfet)
-
10
Pd
Maximum power dissipation(1) ( Pd mosfets, rth=125oC/W)
-
1
W
ESD1
Electrostatic discharge voltage (Human Body)
-
4
kV
C=100pF, R=1500Ω,
ESD2
Electrostatic discharge voltage (Machine Model)
-
0.5
C=200pF, R=0Ω, L=10µH
T stor.
Max. storage temperature
-55
150
Tj max.
Max. junction temperature
-40
+150
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage parameters are referenced to SOURCE lead. (TAmbient = 25 unless otherwise specified). PCB mounting uses the standard footprint with 70 µm copper thickness.
IPS022G Features
• Over temperature shutdown • Over current shutdown • Active clamp • Low current & logic level input • E.S.D protection