NTLJS3113PT1G, NTLP79002R2, NTLTD7900ZR2 Selling Leads, Datasheet
MFG:ON Package Cooled:2010+ROHS D/C:2100
NTLJS3113PT1G, NTLP79002R2, NTLTD7900ZR2 Datasheet download
Part Number: NTLJS3113PT1G
MFG: ON
Package Cooled: 2010+ROHS
D/C: 2100
MFG:ON Package Cooled:2010+ROHS D/C:2100
NTLJS3113PT1G, NTLP79002R2, NTLTD7900ZR2 Datasheet download
MFG: ON
Package Cooled: 2010+ROHS
D/C: 2100
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PDF/DataSheet Download
Datasheet: NTL4502N
File Size: 86016 KB
Manufacturer: ON SEMICONDUCTOR
Download : Click here to Download
PDF/DataSheet Download
Datasheet: NTL4502N
File Size: 86016 KB
Manufacturer: ON SEMICONDUCTOR
Download : Click here to Download
PDF/DataSheet Download
Datasheet: NTLTD7900ZR2_06
File Size: 182051 KB
Manufacturer: ONSEMI [ON Semiconductor]
Download : Click here to Download
EZFETs™ are an advanced series of Power MOSFETs which contain monolithic back−to−back Zener diodes. These Zener diodes provide protection against ESD and unexpected transients. These miniature surface mount MOSFETs feature ultra low RDS(on) and true logic level performance. EZFET devices are designed for use in low voltage, high speed switching applications where power efficiency is important. Typical applications are DC−DC converters, and power management in portable and battery powered products such as computers, printers, cellular and cordless phones.
Rating | Symbol | 10 Sec | Steady State |
Unit |
Drain−to−Source Voltage | VDSS | 20 | V | |
Gate−to−Source Voltage | VGS | ±12 | V | |
Continuous Drain Current (Note 1) TA = 25°C TA = 85°C |
ID | 9.0 6.4 |
6.0 4.3 |
A |
Pulsed Drain Current (tp 10 s) |
IDM | 30 | A | |
Continuous Source−Diode Conduction (Note 1) |
Is | 2.9 | 1.4 | A |
Total Power Dissipation (Note 1) TA = 25°C TA = 85°C |
PD | 3.2 1.7 |
1.5 0.79 |
W |
Operating Junction and Storage Temperature Range |
TJ, Tstg | −55 to 150 | °C | |
Thermal Resistance (Note 1) Junction−to−Ambient |
RJA | 38 | 82 | °C/W |
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. When surface mounted to 1 x 1 FR−4 board.