Features: • FETKY™ Configuration with MOSFET plus Low Vf Schottky Diode• COO™Package Provides Exposed Drain Pad for Excellent Thermal Conduction• 2x2 mm Footprint Same as SC−88 Package Design• Independent Pinout Provides Circuit Design Flexibility• L...
NTLJF3117P: Features: • FETKY™ Configuration with MOSFET plus Low Vf Schottky Diode• COO™Package Provides Exposed Drain Pad for Excellent Thermal Conduction• 2x2 mm Footprint Same ...
SeekIC Buyer Protection PLUS - newly updated for 2013!
268 Transactions
All payment methods are secure and covered by SeekIC Buyer Protection PLUS.
Parameter |
Symbol |
Value |
Unit | ||
Drain−to−Source Voltage |
VDSS |
−20 |
|||
Gate−to−Source Voltage |
VGS |
±8.0 |
|||
Continuous Drain Current (Note 1) |
Steady State |
TA = 25°C |
ID |
−3.3 |
|
TA = 85°C |
−2.4 |
||||
t 5 s | TA = 25°C |
−4.1 |
|||
Power Dissipation (Note 1) |
Steady State |
TA = 25°C |
PD |
1.5 |
|
t 5 s |
2.3 |
||||
Continuous Drain Current (Note 2) |
Steady State |
TA = 25°C |
ID |
−2.3 |
|
TA = 85°C |
−1.6 |
||||
Power Dissipation (Note 2) |
TA = 25°C |
PD |
0.71 |
||
Pulsed Drain Current | tp = 10 s |
IDM |
−20 |
||
Operating Junction and Storage Temperature |
TJ, TSTG |
−55 to150 |
|||
Source Current (Body Diode) (Note 2) |
IS |
−1.9 |
|||
Lead Temperature for Soldering Purposes (1/8 from case for 10 s) |
TL |
260 |