Features: • WDFN 2x2 mm Package Provides Exposed Drain Pad for Excellent Thermal Conduction• Footprint Same as SC−88 Package• 1.8 V VGS Rated RDS(on)• Low Profile (< 0.8 mm) for Easy Fit in Thin Environments• Low VF 2 A Schottky Diode• This is a Pbͨ...
NTLJF3118N: Features: • WDFN 2x2 mm Package Provides Exposed Drain Pad for Excellent Thermal Conduction• Footprint Same as SC−88 Package• 1.8 V VGS Rated RDS(on)• Low Profile (<...
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• WDFN 2x2 mm Package Provides Exposed Drain Pad for Excellent Thermal Conduction
• Footprint Same as SC−88 Package
• 1.8 V VGS Rated RDS(on)
• Low Profile (< 0.8 mm) for Easy Fit in Thin Environments
• Low VF 2 A Schottky Diode
• This is a Pb−Free Device
Parameter | Symbol | Value | Unit | ||
Drain−to−Source Voltage | VDSS | 20 | V | ||
Gate−to−Source Voltage | VGS | ±12 | V | ||
Continuous Drain Current (Note 1) |
Steady State |
TA = 25°C | ID | 3.8 | A |
TA = 85°C | 2.8 | ||||
t 5 s | TA = 25°C | 4.6 | |||
Power Dissipation (Note 1) |
Steady State |
TA = 25°C | PD | 1.5 | W |
t 5 s | 2.2 | ||||
Continuous Drain Current (Note 2) |
Steady State |
TA = 25°C | ID | 2.6 | A |
TA = 85°C | 1.9 | ||||
Power Dissipation (Note 2) |
TA = 25°C | PD | 0.7 | ||
Pulsed Drain Current | tp = 10 s | IDM | 18 | A | |
Operating Junction and Storage Temperature | TJ, TSTG |
−55 to 150 | °C | ||
Source Current (Body Diode) | IS | 1.8 | A | ||
Lead Temperature for Soldering Purposes (1/8 from case for 10 s) |
TL | 260 | °C |
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 2 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size.