Features: • Complementary N−Channel and P−Channel MOSFET• WDFN Package with Exposed Drain Pad for Excellent Thermal Conduction• Footprint Same as SC−88 Package• Leading Edge Trench Technology for Low On Resistance• 1.8 V Gate Threshold Voltage•...
NTLJD3119C: Features: • Complementary N−Channel and P−Channel MOSFET• WDFN Package with Exposed Drain Pad for Excellent Thermal Conduction• Footprint Same as SC−88 Package...
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Parameter | Symbol | Value | Unit | ||
Drain−to−Source Voltage | N−Ch | VDSS | 20 | V | |
P−Ch | -20 | ||||
Gate−to−Source Voltage | N−Ch | VGS | ±8.0 | V | |
P−Ch | |||||
N−Channel Continuous Drain Current (Note 1) |
Steady State |
TA = 25°C | ID | 3.8 | A |
TA = 85°C | 2.8 | ||||
t 5 s | TA = 25°C | 4.6 | |||
P−Channel Continuous Drain Current (Note 1) |
Steady State |
TA = 25°C | ID | -3.3 | A |
TA = 85°C | -2.4 | ||||
t 5 s | TA = 25°C | -4.1 | |||
Power Dissipation (Note 1) |
Steady State |
TA = 25°C | PD | 1.5 | W |
t 5 s | 2.3 | ||||
N−Channel Continuous Drain Current (Note 2) |
Steady State |
TA = 25°C | ID | 2.6 | A |
1.9 | |||||
P−Channel Continuous Drain Current (Note 2) |
Steady State |
TA = 25°C | ID | -2.3 | A |
-1.6 | |||||
Power Dissipation (Note 2) |
Steady State |
TA = 25°C | PD | 0.71 | W |
Pulsed Drain Current | N−Ch | tp = 10s | IDM | 18 | A |
P−Ch | -20 | ||||
Operating Junction and Storage Temperature | TJ, TSTG | −55 to 150 |
|||
Lead Temperature for Soldering Purposes (1/8 from case for 10 s) |
TL | 260 |
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. Surface Mounted on FR4 Board using 1 in sq pad size (Cu area = 1.127 in sq [2 oz] including traces).
2. Surface Mounted on FR4 Board using the minimum recommended pad size of 30 mm2, 2 oz Cu.