STY15NA100, STY16NA90, STY25NA60 Selling Leads, Datasheet
MFG:ST Package Cooled:9800 D/C:TO
STY15NA100, STY16NA90, STY25NA60 Datasheet download
Part Number: STY15NA100
MFG: ST
Package Cooled: 9800
D/C: TO
MFG:ST Package Cooled:9800 D/C:TO
STY15NA100, STY16NA90, STY25NA60 Datasheet download
MFG: ST
Package Cooled: 9800
D/C: TO
Want to post a buying lead? If you are not a member yet, please select the specific/related part number first and then fill the quantity and your contact details in the "Request for Quotation Form" on the left, and then click "Send RFQ".Your buying lead can then be posted, and the reliable suppliers will quote via our online message system or other channels soon.
TOP
PDF/DataSheet Download
Datasheet: STY15NA100
File Size: 45766 KB
Manufacturer: STMICROELECTRONICS [STMicroelectronics]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: STY16NA90
File Size: 48743 KB
Manufacturer: STMICROELECTRONICS [STMicroelectronics]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: STY25NA60
File Size: 84753 KB
Manufacturer: STMICROELECTRONICS [STMicroelectronics]
Download : Click here to Download
The Max247TM package is a new high volume power package exibiting the same footprint as the industry standard TO-247, but designed to accomodate much larger silicon chips, normally supplied in bigger packages such as TO-264. The increased die capacity makes the device ideal to reduce component count in multiple paralleled designs and save board space with respect to larger packages.
Symbol | Parameter | Value | Unit |
VDS |
Drain-source Voltage (VGS = 0) |
1000 | V |
VDGR |
Drain- gate Voltage (RGS = 20 k) |
1000 | V |
VGS |
Gate-source Voltage |
±30 | V |
ID |
Drain Current (continuous) at Tc = 25 |
15 | A |
ID |
Drain Current (continuous) at Tc = 100 |
9.5 | A |
IDM(•) |
Drain Current (pulsed) |
60 | A |
PTOT |
Total Dissipation at Tc = 25 |
300 | W |
Derating Factor |
2.4 | W/ | |
Tstg |
Storage Temperature |
-55 to 150 | |
Tj |
Max. Operating Junction Temperature |
150 |
The Max247TM package is a new high volume power package exibiting the same footprint as theb industry standard TO-247, but designed to accomodate much larger silicon chips, normally supplied in bigger packages such as TO-264. The increased die capacity makes the device ideal to reduce component count in multiple paralleled designs and save board space with respect to larger packages.
Symbol | Parameter | Value | Unit |
VDS |
Drain-source Voltage (VGS = 0) |
900 | V |
VDGR |
Drain- gate Voltage (RGS = 20 k) |
900 | V |
VGS |
Gate-source Voltage |
±30 | V |
ID |
Drain Current (continuous) at Tc = 25 |
16 | A |
ID |
Drain Current (continuous) at Tc = 100 |
10 | A |
IDM(`) |
Drain Current (pulsed) |
64 | A |
PTOT |
Total Dissipation at Tc = 25 |
300 | W |
Derating Factor |
2.4 | W/ | |
Tstg |
Storage Temperature |
-55 to 150 | |
Tj |
Max. Operating Junction Temperature |
150 |
The Max247TM package is a new high volume power package exibiting the same footprint as the industry standard TO-247, but designed to accomodate much larger silicon chips, normally supplied in bigger packages such as TO-264.The increased die capacity makes the device idealto reduce component count in multiple paralleled designs and save board space with respect to larger packages.
Symbol | Parameter | Value | Unit |
VDS |
Drain-source Voltage (VGS = 0) |
600 | V |
VDGR |
Drain- gate Voltage (RGS = 20 k) |
600 | V |
VGS |
Gate-source Voltage |
±30 | V |
ID |
Drain Current (continuous) at Tc = 25 |
25 | A |
ID |
Drain Current (continuous) at Tc = 100 |
16.5 | A |
IDM(`) |
Drain Current (pulsed) |
100 | A |
PTOT |
Total Dissipation at Tc = 25 |
300 | W |
Derating Factor |
2.4 | W/ | |
Tstg |
Storage Temperature |
-65 to 150 | |
Tj |
Max. Operating Junction Temperature |
150 |