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STY30NA50

Application·HIGH CURRENT, HIGH SPEED SWITCHING·SWITCH MODE POWER SUPPLIES (SMPS)·DC-AC CONVERTERS FOR WELDING EQUIPMENTAND UNINTERRUPTIBLE POWER SUPPLIES (UPS)Specifications Symbol Parameter Value Unit VDS Drain-source Voltage (VGS = 0) 500 V VDGR Drain- gate Voltage (RGS = ...

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STY30NA50: Application·HIGH CURRENT, HIGH SPEED SWITCHING·SWITCH MODE POWER SUPPLIES (SMPS)·DC-AC CONVERTERS FOR WELDING EQUIPMENTAND UNINTERRUPTIBLE POWER SUPPLIES (UPS)Specifications Symbol Parameter ...

STY30NA50 Data Sheet

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Part Number:
STY30NA50
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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Upload time: 2024/11/18

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Product Details

Description



Application

· HIGH CURRENT, HIGH SPEED SWITCHING
· SWITCH MODE POWER SUPPLIES (SMPS)
· DC-AC CONVERTERS FOR WELDING EQUIPMENTAND UNINTERRUPTIBLE POWER SUPPLIES (UPS)


Specifications

Symbol Parameter Value Unit
VDS

Drain-source Voltage (VGS = 0)

 500 V
VDGR

Drain- gate Voltage (RGS = 20 k)

 500 V
VGS

Gate-source Voltage

 ±30 V
ID

Drain Current (continuous) at Tc = 25

30 A
ID

Drain Current (continuous) at Tc = 100

19 A
IDM(`)

Drain Current (pulsed)

 120 A
Ptot

Total Dissipation at Tc = 25

300 W

Derating Factor

 2.4 W/
Tstg

Storage Temperature

 -55 to 150
Tj

Max. Operating Junction Temperature

 150
(•) Pulse width limited by safe operating area


Description

The Max247TM package STY30NA50 is a new high volume power package exibiting the same footprint as the industry standard TO-247, but designed to accomodate much larger silicon chips, normally supplied in bigger packages such as TO-264. The increased die capacity makes the device ideal to reduce component count in multiple paralleled designs and save board space with respect to larger packages.




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