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The Max247TM package is a new high volume power package exibiting the same footprint as the industry standard TO-247, but designed to accomodate much larger silicon chips, normally supplied in bigger packages such as TO-264. The increased die capacity makes the device ideal to reduce component count in multiple paralleled designs and save board space with respect to larger packages.
STY30NA50 Maximum Ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source Voltage (VGS = 0)
500
V
VDGR
Drain- gate Voltage (RGS = 20 k)
500
V
VGS
Gate-source Voltage
±30
V
ID
Drain Current (continuous) at Tc = 25
30
A
ID
Drain Current (continuous) at Tc = 100
19
A
IDM(`)
Drain Current (pulsed)
120
A
Ptot
Total Dissipation at Tc = 25
300
W
Derating Factor
2.4
W/
Tstg
Storage Temperature
-55 to 150
Tj
Max. Operating Junction Temperature
150
(•) Pulse width limited by safe operating area
STY30NA50 Typical Application
· HIGH CURRENT, HIGH SPEED SWITCHING · SWITCH MODE POWER SUPPLIES (SMPS) · DC-AC CONVERTERS FOR WELDING EQUIPMENTAND UNINTERRUPTIBLE POWER SUPPLIES (UPS)
The SuperMESH™ series is obtained through an extreme optimization of ST's well established strip-based PowerMESH™ layout. In addition to pushing on-resistance significantly down, special care is taken to ensure a very good dv/dt capability for the most demanding applications.Such series complements ST full range of high voltage MOSFETs including revolutionary MDmesh™ products.