SHF-0289, SHF0589, SHF-0589 Selling Leads, Datasheet
MFG:SIRENZA Package Cooled:new and original D/C:08+/09+
SHF-0289, SHF0589, SHF-0589 Datasheet download
Part Number: SHF-0289
MFG: SIRENZA
Package Cooled: new and original
D/C: 08+/09+
MFG:SIRENZA Package Cooled:new and original D/C:08+/09+
SHF-0289, SHF0589, SHF-0589 Datasheet download
MFG: SIRENZA
Package Cooled: new and original
D/C: 08+/09+
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PDF/DataSheet Download
Datasheet: SHF-0289
File Size: 542702 KB
Manufacturer: ETC [ETC]
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PDF/DataSheet Download
Datasheet: SHF-0186
File Size: 163220 KB
Manufacturer: ETC [ETC]
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PDF/DataSheet Download
Datasheet: SHF-0589
File Size: 200050 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
Stanford Microdevices SHF-0289 series is a high performance GaAs Heterostructure FET housed in a low-cost surface-mount plastic package. HFET technology improves breakdown voltage while minimizing Schottky leakage current for higher power added efficiency and improved linearity.
Output power at 1dB compression for the SHF-0289 is +30dBm when biased for Class AB operation at 8V and 250mA. The +46 dBm third order intercept makes it ideal for high dynamic range, high intercept point requirements. They are well suited for use in both analog and digital wireless communication infrastructure and subscriber equipment including cellular PCS, CDPD, wireless data, and pagers.
Adequate heat sinking must be provided for this part to avoid exceeding the maximum junction temperature. Methods include the use of screws near the device, and filled vias beneath the part to the ground plane. Refer to"Mounting and Thermal Considerations" section on page 7 for more information.
Parameter |
Symbol |
Value |
Unit |
Drain to Source Voltage |
VDS |
+12 |
V |
Gate to Source Voltage |
VGS |
-5 to 0 |
V |
RF Input Power |
PIN |
200 |
mW |
Operating Temperature |
TOP |
-45 to +85 |
|
Channel Temperature |
TCH |
+175 |
|
Storage Temperature |
TSTG |
-65 to +175 |
Sirenza Microdevices' SHF-0589 is a high performance AlGaAs/GaAs Heterostructure FET (HFET) housed in a low-cost surface-mount plastic package. The HFET technology improvesbreakdown voltage while minimizing Schottky leakage current resulting in higher PAE and improved linearity.
Output power at 1dB compression is +33.4 dBm when biased for Class AB operation at 7V,345mA at 1.96 GHz. The +46.5 dBm third order intercept makes it ideal for high dynamic range,high intercept point requirements. It is well suited for use in both analog and digital wireless communication infrastructure and subscriber equipment including 3G, cellular, PCS, fixed wireless, and pager systems.
Parameter |
Symbol |
Value |
Unit |
Drain Current |
IDS |
640 |
mA |
Forward Gate Current |
IGSF |
4.8 |
mA |
Reverse Gate Current |
IGSR |
4.8 |
mA |
Drain-to-Source Voltage |
VDS |
9.0 |
V |
Gate-to-Source Voltage |
VGS |
<-5 or>0 |
V |
RF Input Power |
PIN |
800 |
mW |
Operating Lead Temperature |
TL |
See Graph |
°C |
Storage Temperature Range |
Tstg |
-40 to +125 |
°C |
Power Dissipation |
PD |
See Graph |
W |
Channel Temperature |
TJ |
165 |
°C |
Operation of this device beyond any one of these limits may cause permanent damage. For reliable continuous operation, the device voltage and current must not exceed the maximum operating values specified in the table on page 1.