SHF-0186K, SHF-0189, SHF0289 Selling Leads, Datasheet
MFG:Sirenza D/C:N/A
SHF-0186K, SHF-0189, SHF0289 Datasheet download
Part Number: SHF-0186K
MFG: Sirenza
Package Cooled:
D/C: N/A
MFG:Sirenza D/C:N/A
SHF-0186K, SHF-0189, SHF0289 Datasheet download
MFG: Sirenza
Package Cooled:
D/C: N/A
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PDF/DataSheet Download
Datasheet: SHF-0186K
File Size: 170508 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: SHF-0189
File Size: 108862 KB
Manufacturer:
Download : Click here to Download
PDF/DataSheet Download
Datasheet: SHF-0186
File Size: 163220 KB
Manufacturer: ETC [ETC]
Download : Click here to Download
Stanford Microdevices' SHF-0186K is a high performance GaAs Heterostructure FET housed in a low-cost surface-mount plastic package. HFET technology improves breakdown voltage while minimizing Schottky leakage current for higher power added efficiency and improved linearity.
Output power at 1dB compression for the SHF-0186K is +28 dBm when biased for Class AB operation at 8V and 100mA. The +40 dBm third order intercept makes it ideal for high dynamic range, high intercept point requirements. It is well suited for use in both analog and digital wireless communication infrastructure and subscriber equipment including cellular PCS, CDPD, wireless data, and pagers.
Parameter |
Symbol |
Value |
Unit |
Drain to Source Voltage |
VDS |
+12 |
V |
Gate to Source Voltage |
VGS |
-5 to 0 |
V |
RF Input Power |
PIN |
200 |
mW |
Operating Temperature |
TOP |
-45 to +85 |
|
Storage Temperature |
Tstg |
-65 to +175 |
|
Operating Junction Temperature |
TJ |
+175 |
Sirenza Microdevices' SHF-0189 is a high performance AlGaAs/GaAs Heterostructure FET (HFET) housed in a low-cost surface-mount plastic package. The HFET technology improves breakdown voltage while minimizing Schottky leakage current resulting in higher PAE and improved linearity.
Output power at 1dB compression for the SHF-0189 is +27 dBm when biased for Class AB operation at 8V,100mA. The +40 dBm third order intercept makes it ideal for high dynamic range, high intercept point requirements. It is well suited for use in both analog and digital wireless communication infrastructure and subscriber equipment including 3G, cellular, PCS, fixed wireless, and pager systems.
The matte tin finish on Sirenza's lead-free package utilizes a post annealing process to mitigate tin whisker formation and is RoHS compliant per EU Directive 2002/95. This package is also manufactured with green molding compounds that contain no antimony trioxide nor halogenated fire retardants.
Parameter |
Symbol |
Value |
Unit |
Drain Current |
IDS |
200 |
mA |
Forward Gate Current |
IGSF |
1.2 |
mA |
Reverse Gate Current |
IGSR |
1.2 |
mA |
Drain-to-Source Voltage |
VDS |
+9.0 |
V |
Gate-to-Source Voltage |
VGS |
<-5 or >0 |
V |
RF Input Power |
PIN |
200 |
mW |
Operating Lead Temperature |
TL |
See Graph |
°C |
Storage Temperature Range |
Tstor |
-40 to +150 |
°C |
Power Dissipation |
PDISS |
See Graph |
W |
Channel Temperature |
TJ |
+165 |
°C |
Operation of this device beyond any one of these limits may cause permanent damage. For reliable continuous operation, the device voltage and current must not exceed the maximum operating values specified in the table on page 1. |