NTACT250/12, NTAH28AG, NTB10N40 Selling Leads, Datasheet
MFG:N/A Package Cooled:200 D/C:N/A
NTACT250/12, NTAH28AG, NTB10N40 Datasheet download
Part Number: NTACT250/12
MFG: N/A
Package Cooled: 200
D/C: N/A
MFG:N/A Package Cooled:200 D/C:N/A
NTACT250/12, NTAH28AG, NTB10N40 Datasheet download
MFG: N/A
Package Cooled: 200
D/C: N/A
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PDF/DataSheet Download
Datasheet: NTA0312M
File Size: 150405 KB
Manufacturer: CANDD [C&D Technologies]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: NTA0312M
File Size: 150405 KB
Manufacturer: CANDD [C&D Technologies]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: NTB10N40
File Size: 72740 KB
Manufacturer: ON SEMICONDUCTOR
Download : Click here to Download
Designed for high voltage, high speed switching applications in power supplies, converters, power motor controls and bridge circuits.
Rating |
Symbol |
Value |
Unit |
DrainSource Voltage |
VDSS |
400 |
Vdc |
DrainGate Voltage (RGS = 1.0 M ) |
VDGR |
400 |
Vdc |
GateSource Voltage Continuous NonRepetitive (tp10 ms) |
VGS VGSM |
±20 ±40 |
Vdc |
Drain Continuous Continuous @ 100°C Single Pulse (tp10 ms) |
ID I D IDM |
10 7.5 35 |
Adc |
Total Power Dissipation Derate above 25°C |
PD |
142 1.14 |
Watts W/°C |
Operating and Storage Temperature Range |
TJ, Tstg |
55 to 150 |
°C |
Single DraintoSource Avalanche Energy Starting TJ = 25°C (VDD = 100 Vdc, VGS = 10 Vdc, IL = 10 A, L = 10 mH, RG = 25 ) |
EAS |
500 |
mJ |
Thermal Resistance JunctiontoCase JunctiontoAmbient JunctiontoAmbient (Note 1.) |
R JC R JA RJA |
0.88 62.5 50 |
°C/W |
Maximum Lead Temperature for Soldering Purposes, 1/8, from case for 10 seconds |
TL |
260 |
°C |
1. When surface mounted to an FR4 board using the minimum recommended pad size.
This document contains information on a new product. Specifications and information herein are subject to change without notice.