MTB20N20E, MTB20N20E/D, MTB23P06 Selling Leads, Datasheet
MFG:MOT Package Cooled:TO-263 D/C:TO
MTB20N20E, MTB20N20E/D, MTB23P06 Datasheet download
Part Number: MTB20N20E
MFG: MOT
Package Cooled: TO-263
D/C: TO
MFG:MOT Package Cooled:TO-263 D/C:TO
MTB20N20E, MTB20N20E/D, MTB23P06 Datasheet download
MFG: MOT
Package Cooled: TO-263
D/C: TO
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Datasheet: MTB20N20E
File Size: 264924 KB
Manufacturer: MOTOROLA [Motorola, Inc]
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PDF/DataSheet Download
Datasheet: MTB20N20E/D
File Size: 227875 KB
Manufacturer:
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PDF/DataSheet Download
Datasheet: MTB23P06
File Size: 255086 KB
Manufacturer: MOTOROLA [Motorola, Inc]
Download : Click here to Download
The D2PAK package has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS(on) capabilities. This advanced TMOS EFET is designed to withstand high energy in the avalanche and commutation modes. The new energy efficient design also offers a draintosource diode with a fast recovery time. Designed for low voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients.
Rating |
Symbol |
Value |
Unit |
DraintoSource Voltage |
VDSS |
200 |
Vdc |
DraintoGate Voltage (RGS = 1.0 M) |
VDGR |
200 |
Vdc |
GatetoSource Voltage - Continuous - NonRepetitive (tp 10 ms) |
VGS VGSM |
± 20 ± 40 |
Vdc Vpk |
Drain Current - Continuous - Continuous @ 100 - Single Pulse (tp 10 s) |
ID ID IDM |
20 12 60 |
Adc Apk |
Total Power Dissipation @ 25 Derate above 25 Total Power Dissipation @ TA = 25 (1) |
PD |
125 1.0 2.5 |
Watts W/ Watts |
Operating and Storage Temperature Range |
TJ, Tstg |
55 to 150 |
|
Single Pulse DraintoSource Avalanche Energy - Starting TJ = 25 (VDD = 100 Vdc, VGS = 10 Vdc, Peak IL = 3.0 Apk, L = 10 mH, RG = 25 ) |
EAS |
45 |
mJ |
Thermal Resistance - Junction to Case - Junction to Ambient - Junction to Ambient (1) |
RJC RJA RJA |
1.0 62.5 50 |
/W |
Maximum Lead Temperature for Soldering Purposes, 1/8"from case for 10 seconds |
TL |
260 |
Designer's Data for "Worst Case" Conditions - The Designer's Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves - representing boundaries on device characteristics - are given to facilitate "worst case" design.
EFET and Designer's are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
Thermal Clad is a trademark of the Bergquist Company.