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This P-Channel Logic Level MOSFET is produced using Fairchild Semiconductor's advanced PowerTrench process that has been especially tailored to minimize on-state resistance and yet maintain superior switching performance.
These devices are well suited for low voltage and battery powered applications where low in-line power loss and fast switching are required.
FDG316P Maximum Ratings
Symbol
Parameter
Ratings
Units
VDSS VGSS
Drain-Source Voltage Gate-Source Voltage
-30 ±20 -1.6 -6 0.75 0.48 -55 to +150
V V A
W
°C
ID
Drain Current Continuous Pulsed
(Note 1a)
PD
Power Dissipation for Single Operation
(Note 1a) (Note 1b)
TJ,TSTG
Operating and Storage Junction Temperature Range
FDG316P Features
• -1.6 A, -30 V. RDS(ON) = 0.19 Ω @ VGS = -10 V RDS(ON) = 0.30 Ω @ VGS = -4.5 V. • Low gate charge (3.5nC typical). • High performance trench technology for extremely low RDS(ON). • Compact industry standard SC70-6 surface mount package.
FDG316P Typical Application
• DC/DC converter • Load switch • Power Management
FDG316P Connection Diagram
FDG326P Parameters
Technical/Catalog Information
FDG326P
Vendor
Fairchild Semiconductor
Category
Discrete Semiconductor Products
Mounting Type
Surface Mount
FET Polarity
P-Channel
Drain to Source Voltage (Vdss)
20V
Current - Continuous Drain (Id) @ 25° C
1.5A
Rds On (Max) @ Id, Vgs
140 mOhm @ 1.5A, 4.5V
Input Capacitance (Ciss) @ Vds
467pF @ 10V
Power - Max
480mW
Packaging
Tape & Reel (TR)
Gate Charge (Qg) @ Vgs
7nC @ 4.5V
Package / Case
SC-70-6, SC-88, SOT-323-6, SOT-363
FET Feature
Logic Level Gate
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
FDG326P FDG326P
FDG326P General Description
This P-Channel 1.8V specified MOSFET uses Fairchild's advanced low voltage PowerTrench process. It has been optimized for battery power management applications.
FDG326P Maximum Ratings
Symbol
Parameter
Ratings
Units
VDSS VGSS
Drain-Source Voltage Gate-Source Voltage
20 ± 8 1.5 6 0.75 0.48 -55 to +150
V V A
W
°C
ID
Drain Current Continuous Pulsed
(Note 1a)
PD
Maximum Power Dissipation
(Note 1a) (Note 1b)
TJ,TSTG
Operating and Storage Junction Temperature Range
FDG326P Features
• 1.5 A, 20 V. RDS(ON) = 140 mΩ @ VGS = 4.5 V RDS(ON) = 180 mΩ @ VGS = 2.5 V RDS(ON) = 250 mΩ @ VGS = 1.8 V • Low gate charge • High performance trench technology for extremely low RDS(ON) • Compact industry standard SC70-6 surface mount package
FDG326P Typical Application
• Battery management • Load switch
FDG326P Connection Diagram
FDG327N Parameters
Technical/Catalog Information
FDG327N
Vendor
Fairchild Semiconductor
Category
Discrete Semiconductor Products
Mounting Type
Surface Mount
FET Polarity
N-Channel
Drain to Source Voltage (Vdss)
20V
Current - Continuous Drain (Id) @ 25° C
1.5A
Rds On (Max) @ Id, Vgs
90 mOhm @ 1.5A, 4.5V
Input Capacitance (Ciss) @ Vds
423pF @ 10V
Power - Max
380mW
Packaging
Tape & Reel (TR)
Gate Charge (Qg) @ Vgs
6.3nC @ 4.5V
Package / Case
SC-70-6, SC-88, SOT-323-6, SOT-363
FET Feature
Logic Level Gate
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
FDG327N FDG327N
FDG327N General Description
This N-Channel MOSFET has been designed specifically to improve the overall efficiency of DC/DC converters using either synchronous or conventional switching PWM controllers. It has been optimized use in small switching regulators, providing an extremely low RDS(ON) and gate charge (QG) in a small package.
FDG327N Maximum Ratings
Symbol
Parameter
Ratings
Units
VDSS VGSS
Drain-Source Voltage Gate-Source Voltage
20 ± 8 1.5 6 0.42 0.38 -55 to +150
V V A
W
°C
ID
Drain Current Continuous Pulsed
(Note 1a)
PD
Power Dissipation for Single Operation
(Note 1a) (Note 1b)
TJ,TSTG
Operating and Storage Junction Temperature Range
FDG327N Features
· 1.5 A, 20 V. RDS(ON) = 90 mW @ VGS = 4.5 V. RDS(ON) = 100 mW @ VGS = 2.5 V RDS(ON) = 140 mW @ VGS = 1.8 V · Fast switching speed · Low gate charge (4.5 nC typical) · High performance trench technology for extremely low RDS(ON) · High power and current handling capability.
FDG327N Typical Application
· DC/DC converter · Power management · Load switch