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Vendor:Other Category:Other
The MTB3N100D has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Mfg:MOT Pack:D2PAK D/C:07+ Vendor:Other Category:Other
MTB36N06V is a new technology designed to achieve an onresistance area product about onehalf that of standard MOSFETs. This new technology more than doubles the present cell density of our 50 and 60 volt TMOS devices. Ju...
Mfg:ON Pack:05+ D/C:TO-263 Vendor:Other Category:Other
The MTB36N06E has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Vendor:Other Category:Other
MTB36N06D is a new technology designed to achieve an onresistance area product about onehalf that of standard MOSFETs. This new technology more than doubles the present cell density of our 50 and 60 volt TMOS devices. Ju...
Mfg:ON Pack:05+ D/C:TO-263 Vendor:Other Category:Other
The MTB33N10E has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Vendor:Other Category:Other
The MTB33N10D has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Mfg:ON Vendor:Other Category:Other
MTB30P06V is a new technology designed to achieve an onresistance area product about onehalf that of standard MOSFETs. This new technology more than doubles the present cell density of our 50 and 60 volt TMOS devices. Ju...
Vendor:Other Category:Other
MTB30P06D is a new technology designed to achieve an onresistance area product about onehalf that of standard MOSFETs. This new technology more than doubles the present cell density of our 50 and 60 volt TMOS devices. Ju...
Mfg:ON Vendor:Other Category:Other
MTB30N06VL is a new technology designed to achieve an onresistance area product about onehalf that of standard MOSFETs. This new technology more than doubles the present cell density of our 50 and 60 volt TMOS devices. J...
Vendor:Other Category:Other
MTB30N06VD is a new technology designed to achieve an onresistance area product about onehalf that of standard MOSFETs. This new technology more than doubles the present cell density of our 50 and 60 volt TMOS devices. J...
D/C:07+ Vendor:Other Category:Other
The MTB2P50E has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS(...
Vendor:Other Category:Other
The MTB2P50D has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS(...
Mfg:ON Pack:05+ D/C:TO-263 Vendor:Other Category:Other
The MTB2N60E uses an advanced termination scheme to provide enhanced voltageblocking capability without degrading performance over time. In addition, this advanced TMOS EFET is designed to withstand high energy in the av...
Vendor:Other Category:Other
The MTB2N60D uses an advanced termination scheme to provide enhanced voltageblocking capability without degrading performance over time. In addition, this advanced TMOS EFET is designed to withstand high energy in the av...
Mfg:ON Pack:05+ D/C:TO-263 Vendor:Other Category:Other
The MTB2N40E has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS(...
Vendor:Other Category:Other
The MTB2N40D has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS(...
Mfg:ON Pack:05+ D/C:TO-263 Vendor:Other Category:Other
The MTB29N15E is designed to withstand high energy in the avalanche and commutation modes. The new energy efficient design also offers a draintosource diode with a fast recovery time. Designed for low voltage, high speed...
Vendor:Other Category:Other
This advanced TMOS EFET is designed to withstand high energy in the avalanche and commutation modes. The MTB29N15D also offers a draintosource diode with a fast recovery time. Designed for low voltage, high speed switchi...
Mfg:MOT Pack:TO-263 D/C:05+ Vendor:Other Category:Other
MTB23P06V is a new technology designed to achieve an onresistance area product about onehalf that of standard MOSFETs. This new technology more than doubles the present cell density of our 50 and 60 volt TMOS devices. Ju...
Mfg:ON Pack:05+ D/C:TO-263 Vendor:Other Category:Other
The MTB23P06E has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Vendor:Other Category:Other
MTB23P06D designed to achieve an onresistance area product about onehalf that of standard MOSFETs. This new technology more than doubles the present cell density of our 50 and 60 volt TMOS devices. Just as with our TMOS ...
Mfg:ON D/C:03+ Vendor:Other Category:Other
The MTB20N20E has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Vendor:Other Category:Other
The MTB20N20D has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Mfg:ON Pack:05+ D/C:TO-263 Vendor:Other Category:Other
The MTB1N100E has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Vendor:Other Category:Other
The MTB1N100D has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Mfg:ON Pack:05+ D/C:TO-263 Vendor:Other Category:Other
The MTB16N25E has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Vendor:Other Category:Other
The MTB16N25D has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Mfg:ON Vendor:Other Category:Other
MTB15N06V is a new technology designed to achieve an onresistance area product about onehalf that of standard MOSFETs. This new technology more than doubles the present cell density of our 50 and 60 volt TMOS devices. Ju...
Mfg:ON Pack:05+ D/C:TO-263 Vendor:Other Category:Other
The MTB15N06E has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Vendor:Other Category:Other
The MTB15N06D has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Vendor:Other Category:Other
The MTB1306D has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS(...
Mfg:MOTOROLA D/C:02+ Vendor:Other Category:Other
The MTB1306 has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS(o...
Vendor:Other Category:Other
Mfg:N/A Pack:NA/ D/C:09+ Vendor:Other Category:Other
The MTB10N40E has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
Vendor:Other Category:Other
The MTB10N40D has the capability of housing a larger die than any existing surface mount package which allows it to be used in applications that require the use of surface mount components with higher power and lower RDS...
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NPN silicon planar epitaxial microwave transistor MTB10010U with internal input prematching cell in a SOT440A metal ceramic package with base connected to flange.
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Mfg:SHINDENG Pack:ZIP D/C:02+ Vendor:Other Category:Other
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© 2008-2012 SeekIC.com Corp.All Rights Reserved.