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The advanced quad-band Transmit Module designed for mobile handset applications provides full RF transmit functionality in a size of only 36 mm2. The GSM850/900 and DCS/PCS power amplifier blocks including power control are combined with the low insertion loss quad-band pHEMT switch, Tx harmonics filtering, integrated switch decoder, four receive ports, and full ESD protection. This architecture eliminates the need for any PA-to-switch design effort for phone designers. All four Rx ports are frequency independent and allow flexible routing to the transceiver. Fabricated in high-reliability InGaP HBT / pHEMT technology, the module supports GPRS class 12 operation and provides 50 Ohms input and output impedances at all RF input and output ports. The module control inputs are CMOS compatible and has no need for an external reference voltage. With its excellent efficiency performance in all 4 bands, the power amplifier and switch module contributes to the overall talk-time targets of next generation mobile handset designs.
TQM6M4002 Features
• Ultra Compact Size 6.0x6.0x1.1mm3. • High System Efficiency GSM850 40%, GSM900 45% , DCS/PCS 38% • Integrated Power and SP6T Control • Integrated SP6T pHEMT Switch • Free choice of Rx ports for band selection • Integrated Low Pass Tx Harmonics Filter • Positive Supply Voltage 3.0 to 4.5 V. • 50 Input and Output Impedances. • GPRS Class 12 Compatible. • CMOS Compatible Module Control Inputs. • High-Reliability InGaP HBT Technology • Ruggedness 30:1.
TQM6M4002 Typical Application
• GSM GPRS Handsets and Modems • Dual-, Tri-, Quad-band Class 12 Compatible
TQM6M4002 Connection Diagram
TQM713019 Parameters
Technical/Catalog Information
TQM713019
Vendor
Triquint Semiconductor Inc
Category
RF and RFID
Package / Case
10-LGA
Voltage - Supply
3.2V ~ 4.2V
Current - Supply
450mA
Gain
29dB
Frequency
824MHz ~ 849MHz
RF Type
CDMA, CDMA2000, AMPS, IS-95
Packaging
Tape & Reel (TR)
Noise Figure
-
P1db
-
Test Frequency
-
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
TQM713019 TQM713019
TQM713019 General Description
The TQM713019 is a 3V, 2 stage GaAs HBT Power Amplifier Module designed for use in mobile phones. Its extremely small 4x4mm package makes it ideal for today's compact data enabled phones. Its RF performance meets the requirements for products designed to IS-95/98 standards. The TQM713019 is designed on TriQuint's advanced InGaP HBT GaAs technology offering state of the art reliability, temperature stability, and ruggedness. Selectable bias mode and a shutdown mode with low leakage current improves talk and standby time. The output match, realized within the module package, optimizes efficiency/linearity at maximum rated output power. The module is a 4x4mm land grid array with backside ground. The TQM713019 is footprint ompatible with industry standard 4x4mm CDMA PA modules.
TQM713019 Maximum Ratings
Symbol
Parameter
Absolute Maximum Value
Units
PIN
RF Input Power
10
dBm
VCC
Supply Voltage
0.0 to 5.0
VDC
VREF
Reference Voltage
0.0 to 3.5
VDC
VMODE
Vmode (1 bit Bias Control)
0.0 to 3.5
VDC
TCASE
Case Operating Temperature
-40 to +100
TSTORE
Storage Temperature
-55 to +150
Note: The part may not survive all maximums applied simultaneously.
TQM713019 Features
• InGaP HBT Technology • High Efficiency: 41% CDMA • Low Leakage Current: < 1uA • Low Icq = 55mA • Supports new chipsets with Vref @ 2.6V • Capable of running as 0-bit PA in low bias mode to 28dBm • Optimized for 50 system • Small 10 pin 4x4mm module • Excellent Rx band noise performance • CDMA 1XRTT, 1XEV-DO compliant • Full ESD protection
TQM713019 Connection Diagram
TQM7136 General Description
The TQM7136 is a 3V, 2 stage SiGe HBT Power Amplifier Module designed for use in obile phones. Its RF performance meets the requirements for products designed to IS-95/98 standards. The quiescent current of the TQM7136 is set by the base-band processor using two CMOS compatible ICQ control voltages (VCTRL1 and VCTRL2).
Overall current consumption of the device is minimized by selecting the lowest ICQ state available for each power output level. RF input and output matching is included within the module; therefore, minimal external circuitry is required.
The TQM7136 gives excellent RF performance with low current consumption resulting in longer talk times in portable applications. The small 6mm square surface mount package is ideal for new generation small and light phones.
TQM7136 Maximum Ratings
SYMBOL
Parameter
Absolute Maximum Value
Units
VCC1, VCC2
Power Supply Voltage, no RF Applied RF Applied
-0.5 to 6.0 -0.5 to 5.0
VDC
VREF, VCTRL1, and VCTRL2
Bias reference voltages (VREF) and bias control voltage (VCTRL1 and VCTRL2).
-0.5 to 5.0
VDC
PDISS
Power Dissipation
2.5
W
TC
Case Temperature, Survival
-40 to +100
TSTG
Storage Temperature
-40 to +150
RFIN
DC Grounded RF input, 50ohm RF impedance
0 to 0V
VDC
RFOUT
DC Blocked RF output, 50 ohm RF impedance
-20V to 20V
VDC
Note: The part may not survive all maximums applied simultaneously.
TQM7136 Features
· High Efficiency · Three quiescent current states · CMOS compatible logic inputs · Excellent ACP and ALT · Small 8 pin 6x6mm module · Internally matched input and output · Full ESD Protection · Low leakage current
TQM7136 Typical Application
· Cellular Band CDMA IS-95/98 based mobile phones. · Single-Mode, Dual Mode, and Tri Mode CDMA/AMPS phones