TPD1018F, TPD1024AS, TPD1024S Selling Leads, Datasheet
MFG:TOS Package Cooled:SOP-8 D/C:05+
TPD1018F, TPD1024AS, TPD1024S Datasheet download
Part Number: TPD1018F
MFG: TOS
Package Cooled: SOP-8
D/C: 05+
MFG:TOS Package Cooled:SOP-8 D/C:05+
TPD1018F, TPD1024AS, TPD1024S Datasheet download
MFG: TOS
Package Cooled: SOP-8
D/C: 05+
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PDF/DataSheet Download
Datasheet: TPD1018F
File Size: 298885 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TPD1024AS
File Size: 299800 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: TPD1024S
File Size: 203696 KB
Manufacturer: TOSHIBA [Toshiba Semiconductor]
Download : Click here to Download
The TPD1018F is a monolithic power IC for high-side switches. The IC has a vertical MOS FET output that can be directly driven from a CMOS or TTL logic circuit (e.g., an MPU). The device is equipped with intelligent self-protection and diagnostic functions.
Characteristics | Symbol | Rating | Unit | |
Drain-source Voltage | VDS | 60 | V | |
Supply Voltage | DC Pulse |
VDD (1) VDD (2) |
25 60 (Rs = 1, T = 250ms) |
V V |
Input Voltage | DC Pulse |
VIN (1) VIN (2) |
-0.5~25 VDD (1) + 1.5 (t = 100ms) |
V V |
Output Current Input Current Power Dissipation |
IO IIN PD |
0.5 ±10 300 |
A mA mW | |
Operating Temperature Junction Temperature Storage Temperature |
Topr Tj Tstg |
-40~125 150 -55~150 |
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling
Precautions"/Derating Concept and Methods) and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
` A monolithic power IC with a new structure combining a control block (Bi-CMOS) and a vertical power MOS FET (-MOS) on a single chip
` One side of load can be grounded to a high-side switch
` Can directly drive a power load from a microprocessor.
` Built-in protection against overvoltage, thermal shutdown, and load
short-circuiting
` Incorporates a diagnosis function that allows diagnosis output to be read externally in the event of load short-circuiting, overvoltage, or overheating.
` Low on-resistance : RDS (ON) = 0.8 (max)
` Low operating current : IDD =120A (typ.) (@VDD = 13.2V, VIN = 0V)
` 10-pin SSOP package for surface mounting
Characteristic |
Symbol |
Rating |
Unit |
Drain-source voltage |
VDS (DC) |
40 |
V |
Output current |
ID |
1.5 |
A |
Input voltage |
VGS |
− 0.5 to 6 |
V |
Power dissipation |
PD |
1.2 |
W |
Operating temperature |
Topr |
− 40 to 85 |
°C |
Junction temperature |
Tj |
150 |
°C |
Storage temperature |
Tstg |
− 55 to 150 |
°C |
` A monolithic power IC with a new structure combining a control block and a vertical power MOS FET(-MOS) on a single chip.
` Can directly drive a power load from a CMOS logic.
`Built-in protection against overvoltage, load short circuiting, and thermal shutdown.
`Low on resistance : RDS (ON) = 0.5 Ω (max) (@VIN = 5 V, Tj = 25°C)
`Package : TPS Can be packed in tape.
Characteristic |
Symbol |
Symbol |
Unit | |
Drain-source voltage |
VDS (DC) |
40 |
V | |
Output current |
ID |
1.5 |
A | |
Input voltage |
VGS |
−0.5 ~ 6 |
V | |
Power dissipation |
Ta = 25°C |
PD |
1 |
W |
Tc = 25°C |
10 | |||
Operating temperature |
Topr |
−40 ~ 85 |
°C | |
Junction temperature |
Tj |
150 |
°C | |
Storage temperature |
Tstg |
−55 ~ 150 |
°C |
`A monolithic power IC with a new structure combining a control block and a vertical power MOS FET (-MOS) on a single chip.
`Can directly drive a power load from a CMOS logic.
`Built-in protection against overvoltage, load short circuiting, and
`Low on resistance : RDS (ON) = 0.5 Ω(max), (@VIN = 5 V, Tj = 25°C)
`3-pin power-molded package usable for surface mounting.
Characteristic |
Symbol |
Rating |
Unit | |
Drain-source voltage |
VDS (DC) |
40 |
V | |
Output current |
ID |
1.5 |
A | |
Input voltage VGS |
VGS |
−0.5 ~ 6 |
V | |
Power dissipation |
Ta = 25°C |
PD |
1 |
W |
Tc = 25°C |
10 | |||
Operating temperature |
Topr |
−40 ~ 85 |
°C | |
Junction temperature |
Tj |
150 |
°C | |
Storage temperature |
Tstg |
−55 ~ 150 |
°C |