STB100NF04, STB100NF04-1, STB100NF04L Selling Leads, Datasheet
MFG:ST Package Cooled:. D/C:TO
STB100NF04, STB100NF04-1, STB100NF04L Datasheet download
Part Number: STB100NF04
MFG: ST
Package Cooled: .
D/C: TO
MFG:ST Package Cooled:. D/C:TO
STB100NF04, STB100NF04-1, STB100NF04L Datasheet download
MFG: ST
Package Cooled: .
D/C: TO
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PDF/DataSheet Download
Datasheet: STB100NF04
File Size: 598905 KB
Manufacturer: STMICROELECTRONICS [STMicroelectronics]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: STB100NF04-1
File Size: 598905 KB
Manufacturer: STMICROELECTRONICS [STMicroelectronics]
Download : Click here to Download
PDF/DataSheet Download
Datasheet: STB100NF04L
File Size: 253715 KB
Manufacturer: STMICROELECTRONICS [STMicroelectronics]
Download : Click here to Download
This Power Mosfet is the latest development of STMicroelectronics unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
Symbol | Parameter |
Value |
Unit | |
VDS | Drain-source Voltage (VGS = 0) |
40 |
V | |
VDGR | Drain-gate Voltage (RGS = 20 k) |
40 |
V | |
VGS | Gate- source Voltage |
± 20 |
V | |
ID | Drain Current (continuos) at TC = 25 |
120 |
A | |
ID(#) | Drain Current (continuos) at TC = 100 |
120 |
A | |
IDM(`) | Drain Current (pulsed) |
480 |
A | |
PTOT | Total Dissipation at TC = 25 |
300 |
W | |
Derating Factor |
2 |
W/ | ||
dv/dt (1) | Peak Diode Recovery voltage slope |
6 |
V/ns | |
EAS(2) | Single Pulse Avalanche Energy |
1.2 |
J | |
Tj Tstg |
Operating Junction Temperature Storage Temperature |
-55 to 175 |
|
This Power Mosfet is the latest development of STMicroelectronics unique "Single Feature Size™" strip-based process. The resulting transistor shows extremely high packing density for low on-resistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
Symbol | Parameter |
Value |
Unit | |
VDS | Drain-source Voltage (VGS = 0) |
40 |
V | |
VDGR | Drain-gate Voltage (RGS = 20 k) |
40 |
V | |
VGS | Gate- source Voltage |
± 20 |
V | |
ID | Drain Current (continuos) at TC = 25 |
120 |
A | |
ID(#) | Drain Current (continuos) at TC = 100 |
120 |
A | |
IDM(`) | Drain Current (pulsed) |
480 |
A | |
PTOT | Total Dissipation at TC = 25 |
300 |
W | |
Derating Factor |
2 |
W/ | ||
dv/dt (1) | Peak Diode Recovery voltage slope |
6 |
V/ns | |
EAS(2) | Single Pulse Avalanche Energy |
1.2 |
J | |
Tj Tstg |
Operating Junction Temperature Storage Temperature |
-55 to 175 |
|
This Power MOSFET is the latest development of STMicroelectronis unique "Single Feature Size]" strip-based process. The resulting transistor shows extremely high packing density for low onresistance, rugged avalanche characteristics and less critical alignment steps therefore a remarkable manufacturing reproducibility.
Symbol |
Parameter |
Value |
Unit |
VDS VDGR VGS ID(*) ID IDM(•) Ptot dv/dt (1) EAS (2) Tstg Tj |
Drain-source Voltage (VGS = 0) Drain-gate Voltage (RGS = 20 kW) Gate- source Voltage Drain Current (continuos) at TC = 25°C Drain Current (continuos) at TC = 100°C Drain Current (pulsed) Total Dissipation at TC = 25°C Derating Factor Peak Diode Recovery voltage slope Single Pulse Avalanche Energy Storage Temperature Max. Operating Junction Temperature |
40 40 ± 16 100 70 400 300 2 3.6 1.4 -65 to 175 175 |
V V V A A A W W/°C V/ns J °C °C |