SFS9933, SFS9Z24, SFS9Z34 Selling Leads, Datasheet
MFG:SEMIWELL Package Cooled:SOP8 D/C:08+
SFS9933, SFS9Z24, SFS9Z34 Datasheet download
Part Number: SFS9933
MFG: SEMIWELL
Package Cooled: SOP8
D/C: 08+
SFS9933, SFS9Z24, SFS9Z34
- Table of contents:
Info of SFS9933
Info of SFS9Z24
Info of SFS9Z34
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About SFS1601G
PDF/DataSheet Download
Datasheet: SFS1601G
File Size: 86196 KB
Manufacturer: TSC [Taiwan Semiconductor Company, Ltd]
Download : Click here to Download
About SFS9Z24
PDF/DataSheet Download
Datasheet: SFS9Z24
File Size: 287474 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
About SFS9Z34
PDF/DataSheet Download
Datasheet: SFS9Z34
File Size: 291087 KB
Manufacturer: FAIRCHILD [Fairchild Semiconductor]
Download : Click here to Download
SFS9Z24 Maximum Ratings
|
Symbol |
Characteristic |
Value |
Units |
|
VDSS |
Drain-to-Source Voltage |
-60 |
V |
|
ID |
Continuous Drain Current ( TC=25) |
-7.5 |
A
|
| Continuous Drain Current ( TC=100) |
-5.3 | ||
|
IDM |
Drain Current-Pulsed |
-30 |
A |
|
VGS |
Gate-to-Source Voltage |
±30 |
V |
|
EAS |
Single Pulsed Avalanche Energy |
145 |
mJ |
|
IAR |
Avalanche Current |
-7.5 |
A |
|
EAR |
Repetitive Avalanche Energy |
2.9 |
mJ |
|
dv/dt |
Peak Diode Recovery dv/dt |
-5.5 |
V/ns |
|
PD |
Total Power Dissipation ( TC=25) Linear Derating Factor |
29
0.19 |
W
W/°C |
|
TJ,TSTG |
Operating Junction and Storage Temperature Range |
- 55 to +175 |
°C
|
|
TL |
Maximum Lead Temp. for Soldering Purposes, 1/8" from case for 5-seconds |
300 |
SFS9Z24 Features
` Avalanche Rugged Technology
` Rugged Gate Oxide Technology
` Lower Input Capacitance
` Improved Gate Charge
` 175 Operating Temperature
` Extended Safe Operating Area
` Lower Leakage Current : 10 A (Max.) @ VDS = -60V
` Low RDS(ON) : 0.206 (Typ.)
` Rugged Gate Oxide Technology
` Lower Input Capacitance
` Improved Gate Charge
` 175 Operating Temperature
` Extended Safe Operating Area
` Lower Leakage Current : 10 A (Max.) @ VDS = -60V
` Low RDS(ON) : 0.206 (Typ.)
SFS9Z34 Maximum Ratings
|
Symbol |
Characteristic |
Value |
Units |
|
VDSS |
Drain-to-Source Voltage |
-60 |
V |
|
ID |
Continuous Drain Current ( TC=25) |
-12 |
A
|
| Continuous Drain Current ( TC=100) |
-8.4 | ||
|
IDM |
Drain Current-Pulsed |
-48 |
A |
|
VGS |
Gate-to-Source Voltage |
±30 |
V |
|
EAS |
Single Pulsed Avalanche Energy |
555 |
mJ |
|
IAR |
Avalanche Current |
-12 |
A |
|
EAR |
Repetitive Avalanche Energy |
3.6 |
mJ |
|
dv/dt |
Peak Diode Recovery dv/dt |
-5.5 |
V/ns |
|
PD |
Total Power Dissipation ( TC=25) Linear Derating Factor |
36
0.24 |
W
W/°C |
|
TJ,TSTG |
Operating Junction and Storage Temperature Range |
- 55 to +175 |
°C
|
|
TL |
Maximum Lead Temp. for Soldering Purposes, 1/8" from case for 5-seconds |
300 |
SFS9Z34 Features
` Avalanche Rugged Technology
` Rugged Gate Oxide Technology
` Lower Input Capacitance
` Improved Gate Charge
` 175 Operating Temperature
` Extended Safe Operating Area
` Lower Leakage Current : 10 A (Max.) @ VDS = -60V
` Low RDS(ON) : 0.106 (Typ.)
` Rugged Gate Oxide Technology
` Lower Input Capacitance
` Improved Gate Charge
` 175 Operating Temperature
` Extended Safe Operating Area
` Lower Leakage Current : 10 A (Max.) @ VDS = -60V
` Low RDS(ON) : 0.106 (Typ.)
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