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This advanced TMOS EFET is designed to withstand high energy in the avalanche and commutation modes. The new energy efficient design also offers a draintosource diode with a fast recovery time. Designed for low voltage, high speed switching applications in power supplies, converters and PWM motor controls, these devices are particularly well suited for bridge circuits where diode speed and commutating safe operating areas are critical and offer additional safety margin against unexpected voltage transients.
MTW32N25 Maximum Ratings
Rating
Symbol
Value
Unit
DraintoSource Voltage
VDSS
250
Vdc
DraintoGate Voltage (RGS = 1.0 M)
VDGR
250
Vdc
GatetoSource Voltage - Continuous - NonRepetitive (tp 10 ms)
VGS VGSM
± 20 ± 40
Vdc Vpk
Drain Current - Continuous - Continuous @ 100°C - Single Pulse (tp 10 s)
ID ID IDM
32 25 96
Adc
Apk
Total Power Dissipation Derate above 25°C
PD
250 2.0
Watts W/°C
Operating and Storage Temperature Range
TJ, Tstg
55 to 150
°C
Single Pulse DraintoSource Avalanche Energy TJ = 25°C (VDD =100Vdc,VGS = 10Vdc, Vdc,Peak IL =20 Apk, L =3.0 mH, RG = 25)
EAS
600
mJ
Thermal Resistance - Junction to Case - Junction to Ambient
RJC RJA
0.50 40
°C/W
Maximum Lead Temperature for Soldering Purposes, 1/8"from Case for 10 seconds
TL
260
°C
Designer's Data for "Worst Case" Conditions - The Designer's Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves - representing boundaries on device characteristics - are given to facilitate "worst case" design. EFET and Designer's are trademarks of Motorola, Inc. TMOS is a registered trademark of Motorola, Inc.
MTW32N25 Features
• Avalanche Energy Specified • SourcetoDrain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode • Diode is Characterized for Use in Bridge Circuits • IDSS and VDS(on) Specified at Elevated Temperature • Isolated Mounting Hole Reduces Mounting Hardware