MGF0953P, MGF1100, MGF1102 Selling Leads, Datasheet
MFG:MITSUBISHI Package Cooled:N/A D/C:07+
MGF0953P, MGF1100, MGF1102 Datasheet download
Part Number: MGF0953P
MFG: MITSUBISHI
Package Cooled: N/A
D/C: 07+
MFG:MITSUBISHI Package Cooled:N/A D/C:07+
MGF0953P, MGF1100, MGF1102 Datasheet download
MFG: MITSUBISHI
Package Cooled: N/A
D/C: 07+
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Datasheet: MGF0953P
File Size: 224078 KB
Manufacturer: MITSUBISHI
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PDF/DataSheet Download
Datasheet: MGF 1001 P
File Size: 113211 KB
Manufacturer: Mitsubishi
Download : Click here to Download
PDF/DataSheet Download
Datasheet: MGF 1001 P
File Size: 113211 KB
Manufacturer: Mitsubishi
Download : Click here to Download
The MGF0953P GaAs FET with an N-channel schottky gate,is designed for use L & S band amplifiers.
The MGF0953P has four features.The first one is high output power P1dB =28.0dBm(TYP.) @f=2.15GHz,Pin=10dBm.The second one is high linear power gain GLP = 16.5dB(TYP.) @f=2.15GHz.The third one is high power added efficiency PAE = 40%(TYP.) @f=2.15GHz,Pin=10dBm. The fourth one is plastic mold lead-less PKG.
The MGF0953P has some absolute maximum ratings(Ta=25deg.C).When symbol is VGDO,the parameter is gate to drain voltage,the ratings is -15,the unit is V.When symbol is VGSO,the parameter is gate to source voltage,the ratings is -15,the unit is V.When symbol is ID,the parameter is drain current,the ratings is 0.4,the unit is V.When symbol is IGR,the parameter is reverse gate current,the ratings is -1.25,the unit is mA.When symbol is IGF,the parameter is forward gate current,the ratings is 5,the unit is mA.When symbol is PT,the parameter is total power dissipation,the ratings is 6.25,the unit is W.When symbol is Tch,the parameter is channel temperature,the ratings is 150,the unit is deg.C.When symbol is Tstg,the parameter is storage temperature,the ratings is -40 to +150,the unit is deg.C.Mitsubishi Electric Corporation puts the maximum effort into making semiconductor products better and more reliable,but there is always the possibility that trouble may occur with them.Trouble with semiconductors may lead to personal injury, fire or property damage. Remember to give due consideration to safety when making your circuit designs,with appropriate measures such as (1)placement of substitutive, auxiliary circuits, (2)use of non-flammable material or (3)prevention against any malfunction or mishap.