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XP162A01XXPR, XP162A11C0PR, XP162A11COPR

XP162A01XXPR, XP162A11C0PR, XP162A11COPR Selling Leads, Datasheet

MFG:ATMEL  Package Cooled:06+  D/C:09+

XP162A01XXPR, XP162A11C0PR, XP162A11COPR Picture

XP162A01XXPR, XP162A11C0PR, XP162A11COPR Datasheet download

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Part Number: XP162A01XXPR

 

MFG: ATMEL

Package Cooled: 06+

D/C: 09+

 

 

 
 
 
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About XP1001

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Datasheet: XP1001

File Size: 280364 KB

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  • XP162A11C0PR

  • Vendor: TOREX Pack: SOT D/C: 08+& Qty: 22000  Adddate: 2024-06-01
  • Inquire Now
  • ao chuang electronic   China
    Contact: Mr.Ms,Zhao   MSN:aochuang.dz@msn.cn
    Tel: 86-755-83281916
    Fax: 86-755-83281916
    (26)

About XP162A11C0PR

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Datasheet: XP162A11C0PR

File Size: 54128 KB

Manufacturer: TOREX [Torex Semiconductor]

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About XP1001

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Datasheet: XP1001

File Size: 280364 KB

Manufacturer:

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XP162A11C0PR General Description

The XP162A11COPR is a P-Channel Power MOS FET with low on-state resistance and ultra high-speed switching characteristics. Because high-speed switching is possible, the IC can be efficiently set thereby saving energy. In order to counter static, a gate protect diode is built-in. The small SOT-89 package makes high density mounting possible.

XP162A11C0PR Maximum Ratings

PARAMETER SYMBOL RATINGS UNITS
Drain-Source Voltage Vdss -30 V
Gate-Source Voltage Vgss ±20 V
Drain Current (DC) Id -2.5 A
Drain Current (Pulse) Idp 10 A
Reverse Drain Current Idr -2.5 A
Continuous Channel
Power Dissipation (note)
Pd 2 W
Channel Temperature Tch 150
Storage Temperature Tstg -55~150

XP162A11C0PR Features

·Low on-state resistance : Rds (on) = 0.15Ω ( Vgs = -10V )
                                           Rds (on) = 0.28Ω ( Vgs = -4.5V )
·Ultra high-speed switching
·Operational Voltage        : -4.5V
·Gate protect diode built-in
·High density mounting    : SOT - 89

XP162A11C0PR Typical Application

·Notebook PCs
·Cellular and portable phones
·On - board power supplies
·Li - ion battery systems

XP162A11C0PR Connection Diagram

XP162A11COPR General Description

The XP162A11COPR is a P-Channel Power MOS FET with low on-state resistance and ultra high-speed switching characteristics.

Because high-speed switching is possible, the IC can be efficiently set thereby saving energy.


In order to counter static, a gate protect diode is built-in. The small SOT-89 package makes high density mounting possible.

XP162A11COPR Maximum Ratings

PARAMETER
SYMBOL
RATINGS
UNITS
Drain - Source Voltage 
Gate - Source Voltage 
Drain Current (DC) 
Drain Current (Pulse) 
Storage Temperature 
Reverse Drain Current 
Continuous Channel 
Power Dissipation (note) 
Channel Temperature
Vdss
Vgss
Id
Idp
Idr
Pd

Tch
Tstg
-30V 
+ 20V 
-2.5 
-10A 
-2.5 
2 

150 
-55 to 150
V 
V 
A 
A 
A 
W 

 
( note ) : When implemented on a ceramic PCB

XP162A11COPR Features

`Low on-state resistance : Rds (on) = 0.15 ( Vgs = -10V ) Rds (on) = 0.28 ( Vgs = -4.5V )
`Ultra high-speed switching
`Operational Voltage : -4.5V
`Gate protect diode built-in
`High density mounting : SOT - 89

XP162A11COPR Typical Application

·Notebook PCs
·Cellular and portable phones
·On - board power supplies
·Li - ion battery systems

 

XP162A11COPR Connection Diagram

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