XP1009

Features: ·Excellent Linear Output Amplifier Stage·20.0 dB Small Signal Gain·+29.5 dBm P1dB Compression Point·+38.0 dBm Third Order Intercept (OIP3)·100% On-Wafer RF, DC and Output Power Testing·100% Visual Inspection to MIL-STD-883 Method 2010Specifications Supply Voltage (Vd)Supply Current ...

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XP1009 Picture
SeekIC No. : 004548897 Detail

XP1009: Features: ·Excellent Linear Output Amplifier Stage·20.0 dB Small Signal Gain·+29.5 dBm P1dB Compression Point·+38.0 dBm Third Order Intercept (OIP3)·100% On-Wafer RF, DC and Output Power Testing·100...

floor Price/Ceiling Price

Part Number:
XP1009
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

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268 Transactions

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Upload time: 2024/11/20

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Product Details

Description



Features:

·Excellent Linear Output Amplifier Stage
·20.0 dB Small Signal Gain
·+29.5 dBm P1dB Compression Point
·+38.0 dBm Third Order Intercept (OIP3)
·100% On-Wafer RF, DC and Output Power Testing
·100% Visual Inspection to MIL-STD-883 Method 2010



Specifications

Supply Voltage (Vd)

Supply Current (Id1,2)

Gate Bias Voltage

Input Power (Pin)

Storage Temperature (Tstg)

Operating Temperature (Ta)

Channel Temperature (Tch)
+5.5 VDC

330,660 mA

+0.3 VDC

+12 dBm

-65 to +165

-55 to MTTF TAble3

MTTF Table3



Description

Mimix Broadband's two stage 17.0-21.0 GHz GaAs MMIC power amplifier is optimized for linear operation with a third order intercept point of +38.0 dBm. This MMIC XP1009 uses Mimix Broadband's 0.15 µm GaAs PHEMT device model technology, and is based upon electron beam lithography to ensure high repeatability and uniformity. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process. XP1009 is well suited for Millimeter-wave Point-to-Point Radio, LMDS, SATCOM and VSAT applications.




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