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TSB12LV21BPGF, TSB12LV21PGF, TSB12LV22

TSB12LV21BPGF, TSB12LV21PGF, TSB12LV22 Selling Leads, Datasheet

MFG:Texas Instruments  Category:Integrated Circuits (ICs)  Package Cooled:TQFP  D/C:2008+

TSB12LV21BPGF, TSB12LV21PGF, TSB12LV22 Picture

TSB12LV21BPGF, TSB12LV21PGF, TSB12LV22 Datasheet download

Five Points

Part Number: TSB12LV21BPGF

Category: Integrated Circuits (ICs)

MFG: Texas Instruments

Package Cooled: TQFP

D/C: 2008+

Description: IC 3.3V PCI LINK LAYER 176-LQFP

 

 
 
 
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  • TSB12LV01A

  • Vendor: TI Pack: QFP D/C: 00+& Qty: 65 Note: NEW  Adddate: 2024-11-27
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  • SW Electronics Limited   China
    Contact: Mr.FrankLiu   MSN:frankL04@hotmail.com
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  • TSB12LV01A1

  • Vendor: TI Pack: QFP D/C: 00+& Qty: 600 Note: NEW  Adddate: 2024-11-27
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  • SW Electronics Limited   China
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About TSB12LV21BPGF

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Datasheet: TSB12LV21BPGF

File Size: 306788 KB

Manufacturer: TI [Texas Instruments]

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  • TSB12LV01A

  • Vendor: TI Pack: QFP D/C: 00+& Qty: 65 Note: NEW  Adddate: 2024-11-27
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  • SW Electronics Limited   China
    Contact: Mr.FrankLiu   MSN:frankL04@hotmail.com
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  • TSB12LV01A1

  • Vendor: TI Pack: QFP D/C: 00+& Qty: 600 Note: NEW  Adddate: 2024-11-27
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  • TSB12LV01AIPZ

  • Vendor: TI Pack: QFP D/C: 00+& Qty: 74 Note: NEW  Adddate: 2024-11-27
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  • TSB12LV01APZ

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  • TSB12LV21APGF

  • Vendor: TI Pack: QFP D/C: 97+& Qty: 860 Note: I have stock with originalpack   Adddate: 2024-11-27
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  • Shenzhen Viga Electronics Co.,Ltd   China
    Contact: Ms.Suepan   MSN:tatiana0124@hotmail.com
    Tel: 86-755-33090962 33090963
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About TSB10

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Datasheet: TSB10

File Size: 555679 KB

Manufacturer: ETC [ETC]

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  • TSB12LV22

  • Vendor: TI Pack: QFP D/C: 99+& Qty: 500  Adddate: 2024-11-27
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  • Jet Electronics Co., Ltd   China
    Contact: Mr.Jet Chan   MSN:jetlielec@hotmail.com
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  • TSB12LV22PZ

  • Vendor: TI Qty: 27 Note: STOCK-NEW  Adddate: 2024-11-27
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  • InfinityComponents   United
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  • TSB12LV01A

  • Vendor: TI Pack: QFP D/C: 00+& Qty: 65 Note: NEW  Adddate: 2024-11-27
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  • SW Electronics Limited   China
    Contact: Mr.FrankLiu   MSN:frankL04@hotmail.com
    Tel: 86-010-82375981
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    (0)
  • TSB12LV01A1

  • Vendor: TI Pack: QFP D/C: 00+& Qty: 600 Note: NEW  Adddate: 2024-11-27
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  • SW Electronics Limited   China
    Contact: Mr.FrankLiu   MSN:frankL04@hotmail.com
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About TSB12LV22

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Datasheet: TSB12LV22

File Size: 673089 KB

Manufacturer: TI [Texas Instruments]

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TSB12LV21BPGF Parameters

Technical/Catalog InformationTSB12LV21BPGF
VendorTexas Instruments
CategoryIntegrated Circuits (ICs)
Controller TypeLink Layer Controller
InterfaceIEEE 1394
Voltage - Supply3.3V
Current - Supply-
Package / Case176-LQFP
PackagingTray
Operating Temperature-
Lead Free StatusLead Free
RoHS StatusRoHS Compliant
Other Names TSB12LV21BPGF
TSB12LV21BPGF
296 11063 ND
29611063ND
296-11063

TSB12LV22 General Description

The Texas Instruments OHCI-LynxE is a PCI-to-1394 host controller compatible with the latest PCI, IEEE1394, and 1394 OHCI 1.00 specifications. The chip provides the IEEE1394 link function, and is compatible with serial bus data rates of 100 Mbits/s, 200 Mbits/s, and 400 Mbits/s.

As required by the 1394 OHCI Specification, internal control registers are memory mapped and non-prefetchable. The PCI configuration header is accessed through configuration cycles specified by PCI, and provides Plug-and-Play (PnP) compatibility. Furthermore, the OHCI-Lynx is compliant with the PCI Power Management Specification, per the PC 498 requirements.

The OHCI-Lynx design provides PCI bus master bursting, and is capable of transferring a cacheline of data at 132 Mbytes/s after connection to the memory controller. Since PCI latency can be large even on a PCI Revision 2.1 system, deep FIFOs are provided to buffer 1394 data.

Physical write posting buffers are provided to enhance serial bus performance, and multiple isochronous channels are provided for simultaneous operation of real-time applications. The OHCI-Lynx also provides bus holding buffers on the phy interface for simple and cost effective single capacitor isolation. An advanced CMOS process is used to achieve low power consumption while operating at PCI clock rates up to 33 MHz.

TSB12LV22 Maximum Ratings

Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 3.6 V
Supply voltage range, VCCP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0.5 V to 5.5 V
Supply voltage range, VCCS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  0.5 V to 5.5 V
Input voltage range for PCI, VI . . . . . . . . . . . . . . . . . . . . . . . .0.5 to VCCP + 0.5 V
Input voltage range for Miscellaneous and Phy I/F, VI . . . . . . .0.5 to VCCI + 0.5 V
Output voltage range for PCI, VO . . . . . . . . . . . . . . . . . . . . .   0.5 to VCCP + 0.5 V
Input voltage range for Miscellaneous and Phy I/F, VO . . . . .  0.5 to VCCP + 0.5 V
Input clamp current, IIK (VI < 0 or VI > VCC) (see Note 1) . . . . . . . . . . . . .  ±20 mA
Output clamp current, IOK (VO < 0 or VO > VCC) (see Note 2) . . . . . . . . . . .±20 mA
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .65°C to 150°C
NOTES:
1. Applies to external input and bidirectional buffers. For 5-V tolerant use VI > VCCI. For PCI use VI > VCCP.
2. Applies to external output and bidirectional buffers. For 5-V tolerant use VO > VCCI. For PCI use VO > VCCP.

TSB12LV22 Features

· Designed to 1394 Open Host Controller Interface (OHCI) Specification
· IEEE 1394-1995 Compliant and Compatible with Proposal 1394A
· Compliant to Latest PCI Specification, PCI 2.2
· PCI Power Management Compliant
 · 3.3-V Core Logic with Universal PCI Interface Compatible with 3.3-V and 5-V PCI Signaling Environments
· Supports Serial Bus Data Rates of 100, 200, and 400 Mbits/s
· Provides Bus-Hold Buffers on Physical I/F for Low-Cost Single Capacitor Isolation
· Supports Physical Write Posting of Up to Three Outstanding Transactions
· Serial ROM Interface Supports 2-Wire Devices
· Supports External Cycle Timer Control for Customized Synchronization
· Implements PCI Burst Transfers and Deep FIFOs to Tolerate Large Host Latency
· Provides up to Four General Purpose I/Os
 · Fabricated in Advanced Low-Power CMOS Process
· Packaged in 100 LQFP (PZP)

TSB12LV22 Connection Diagram

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