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This 200V MOSFET with a new advanced layout brings all unique advantages of MDmesh technology to lower voltages. The device exhibits worldwide lowest gate charge for any given onresistance.Its use is therefore ideal as primary switch in isolated DC-DC converters for Telecom and Computer applications.Used in combination with secondary-side low-voltage STripFETTM products,it contributes to reducing losses and boosting efficiency.The new PowerFLAT™ package allows a significant reduction in board space without compromising performance.
STL20NM20N Maximum Ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source Voltage (VGS = 0)
150
V
VDGR
Drain-gate Voltage (RGS = 20 k )
150
V
VGS
Gate- source Voltage
± 30
V
ID(1)
Drain Current (continuos) at TC = 25(Steady State) Drain Current (continuos) at TC = 100
20 12.3
A A
IDM(3)
Drain Current (pulsed)
80
A
PTOT(2)
Total Dissipation at TC = 25(Steady State)
2.5
W
Ptot(1)
Total Dissipation at TC = 25(Steady State)
80
W
Derating Factor(2)
0.02
W/
dv/dt(5)
Peak Diode Recovery voltage slope
10
V/ns
STL20NM20N Features
WORLDWIDE LOWEST GATE CHARGE TYPICAL RDS(on) = 0.088 IMPROVED DIE-TO-FOOTPRINT RATIO VERY LOW PROFILE PACKAGE (1mm MAX) VERY LOW THERMAL RESISTANCE LOW GATE RESISTANCE LOW INPUT CAPACITANCE HIGH dv/dt and AVALANCHE CAPABILITIES
STL20NM20N Typical Application
The MDmeshTM family is very suitable for increasing power density allowing system miniaturization and higher efficiencies
STL22NF10 General Description
This application specific Power MOSFET is the second eneration of STMicroelectronis unique "STripFET™"technology. The resulting transistor shows extremely lowon-resistance and minimal gate charge. The newPowerFLAT™ package allows a significant reduction inboard space without compromising performance.
STL22NF10 Maximum Ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source Voltage (VGS = 0)
100
V
VDGR
Drain-gate Voltage (RGS = 20 k )
100
V
VGS
Gate- source Voltage
± 20
V
ID(2)
Drain Current (continuos) at TC = 25(Steady State)
5.3
A
ID(2)
Drain Current (continuos) at TC = 100
3.8
A
IDM(3)
Drain Current (pulsed)
22
A
PTOT(2)
Total Dissipation at TC = 25(Steady State)
4
W
Ptot(1)
Total Dissipation at TC = 25
70
W
Derating Factor
0.03
W/
dv/dt(5)
Peak Diode Recovery voltage slope
16
V/ns
EAS(6)
Single Pulse Avalanche Energy
82
mJ
Tstg
Storage Temperature
55 to 150
Tj
Operating Junction Temperature
STL22NF10 Features
TYPICAL RDS(on) = 0.055 W IMPROVED DIE-TO-FOOTPRINT RATIO VERY LOW PROFILE PACKAGE (1mm MAX) VERY LOW THERMAL RESISTANCE VERY LOW GATE CHARGE
STL22NF10 Typical Application
HIGH-EFFICIENCY ISOLATED DC-DC CONVERTERS TELECOM AND AUTOMOTIVE
STL27N15 General Description
This MOSFET series realized with STMicroelectronics unique "STripFET™" process has specifically been designed to minimize input capacitance and gate charge.It's therefore suitable as primary switch in advanced high efficiency, high frequency isolated DC-DC converter for telecom an computer application. The new PowerFLAT™ package allows e significant reduction in a board space without compromising performance.
STL27N15 Maximum Ratings
Symbol
Parameter
Value
Unit
VDS
Drain-source Voltage (VGS = 0)
150
V
VDGR
Drain-gate Voltage (RGS = 20 k )
150
V
VGS
Gate- source Voltage
± 20
V
ID(2)
Drain Current (continuos) at TC = 25(Steady State)
6
A
ID(2)
Drain Current (continuos) at TC = 100
4
A
IDM(3)
Drain Current (pulsed)
24
A
PTOT(2)
Total Dissipation at TC = 25(Steady State)
4
W
Ptot(1)
Total Dissipation at TC = 25
80
W
Derating Factor
0.03
W/
dv/dt(5)
Peak Diode Recovery voltage slope
TBD
V/ns
Tstg
Storage Temperature
55 to 150
Tj
Operating Junction Temperature
STL27N15 Features
TYPICAL RDS(on) = 0.045 IMPROVED DIE-TO-FOOTPRINT RATIO VERY LOW PROFILE PACKAGE (1mm MAX) VERY LOW THERMAL RESISTANCE VERY LOW GATE CHARGE