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Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300
°C
IXTA2N80 Features
· International standard packages · Low RDS (on) HDMOSTM process · Rugged polysilicon gate cell structure · Low package inductance (< 5 nH) - easy to drive and to protect · Fast switching times
IXTA2N80 Typical Application
· Switch-mode and resonant-mode power supplies · Flyback inverters · DC choppers