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DDR12-25D08-A, DDR161600-5, DDR2

DDR12-25D08-A, DDR161600-5, DDR2 Selling Leads, Datasheet

MFG:ARTESYN  Package Cooled:Module  D/C:04+

DDR12-25D08-A, DDR161600-5, DDR2 Picture

DDR12-25D08-A, DDR161600-5, DDR2 Datasheet download

Five Points

Part Number: DDR12-25D08-A

 

MFG: ARTESYN

Package Cooled: Module

D/C: 04+

 

 

 
 
 
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  • DDR 128MX4 PC333

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  • DDR 16MX16 PC400 PB FREE

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About DDR110-27T7RL

PDF/DataSheet Download

Datasheet: DDR110-27T7RL

File Size: 50841 KB

Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Download : Click here to Download

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DDR161600-5 Suppliers

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  • DDR 16MX16 PC400 PB FREE

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About DDR110-27T7RL

PDF/DataSheet Download

Datasheet: DDR110-27T7RL

File Size: 50841 KB

Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Download : Click here to Download

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  • DDR2 128MX8 PC667 FBGA

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  • DDR2 128MX8 PC800 CL5

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  • DDR2 16MX16 PC533

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About DDR110-27T7RL

PDF/DataSheet Download

Datasheet: DDR110-27T7RL

File Size: 50841 KB

Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Download : Click here to Download

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DDR2 Maximum Ratings

Symbol Parameter Rating Units Notes
VDD Voltage on VDD pin relative to VSS - 1.0 V ~ 2.3 V V 1
VDDQ Voltage on VDDQ pin relative to VSS - 0.5 V ~ 2.3 V V 1
VDDL Voltage on VDDL pin relative to VSS - 0.5 V ~ 2.3 V V 1
VIN, VOUT Voltage on any pin relative to VSS - 0.5 V ~ 2.3 V V 1
TSTG Storage Temperature -55 to +100 °C 1, 2

Note :
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the  evice. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating  onditions for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2 standard.

DDR2 Features

• JEDEC standard 1.8V ± 0.1V Power Supply
• VDDQ = 1.8V ± 0.1V
• 200 MHz fCK for 400Mb/sec/pin, 267MHz fCK for 533Mb/sec/pin, 333MHz fCK for 667Mb/sec/pin
• 8 Banks
• Posted CAS
• ProgrammableCAS Latency: 3, 4, 5
• Programmable Additive Latency: 0, 1 , 2 , 3 and 4
• Write Latency(WL) = Read Latency(RL) -1
• Burst Length: 4 , 8(Interleave/nibble sequential)
• Programmable Sequential / Interleave Burst Mode
• Bi-directional Differential Data-Strobe (Single-ended data-strobe is an optional feature)
• Off-Chip Driver(OCD) Impedance Adjustment
• On Die Termination with selectable values(50/75/150 ohms or disable)
• PASR(Partial Array Self Refresh)
• Average Refresh Period 7.8us at lower than a TCASE 85°C, 3.9us at 85°C < TCASE < 95 °C
- support High Temperature Self-Refresh rate enable feature
• Package: 84ball FBGA - 64Mx16, 70ball FBGA - st.256Mx8
• All of Lead-free products are compliant for RoHS

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