Position: Home  > All Categories> Integrated Circuits (ICs) > DDR2

DDR2

Features: • JEDEC standard 1.8V ± 0.1V Power Supply• VDDQ = 1.8V ± 0.1V• 200 MHz fCK for 400Mb/sec/pin, 267MHz fCK for 533Mb/sec/pin, 333MHz fCK for 667Mb/sec/pin• 8 Banks• Posted CAS• ProgrammableCAS Latency: 3, 4, 5• Programmable Additive Latency: 0, 1 ,...

product image

DDR2 Picture
See larger image
SeekIC No. : 004324781 Detail

DDR2: Features: • JEDEC standard 1.8V ± 0.1V Power Supply• VDDQ = 1.8V ± 0.1V• 200 MHz fCK for 400Mb/sec/pin, 267MHz fCK for 533Mb/sec/pin, 333MHz fCK for 667Mb/sec/pin• 8 Banks...

DDR2 Data Sheet

floor Price/Ceiling Price

Get Latest Price
Part Number:
DDR2
Supply Ability:
5000

Price Break

  • Qty
  • 1~5000
  • Unit Price
  • Negotiable
  • Processing time
  • 15 Days
Total Cost: $ 0.00

SeekIC Buyer Protection PLUS - newly updated for 2013!

  • Escrow Protection.
  • Guaranteed refunds.
  • Secure payments.
  • Learn more >>

Month Sales

268 Transactions

Rating

evaluate  (4.8 stars)

Upload time: 2025/2/15

add to my favourite

Payment Methods

All payment methods are secure and covered by SeekIC Buyer Protection PLUS.

Notice: When you place an order, your payment is made to SeekIC and not to your seller. SeekIC only pays the seller after confirming you have received your order. We will also never share your payment details with your seller.
Product Details

Description



Features:

• JEDEC standard 1.8V ± 0.1V Power Supply
• VDDQ = 1.8V ± 0.1V
• 200 MHz fCK for 400Mb/sec/pin, 267MHz fCK for 533Mb/sec/pin, 333MHz fCK for 667Mb/sec/pin
• 8 Banks
• Posted CAS
• ProgrammableCAS Latency: 3, 4, 5
• Programmable Additive Latency: 0, 1 , 2 , 3 and 4
• Write Latency(WL) = Read Latency(RL) -1
• Burst Length: 4 , 8(Interleave/nibble sequential)
• Programmable Sequential / Interleave Burst Mode
• Bi-directional Differential Data-Strobe (Single-ended data-strobe is an optional feature)
• Off-Chip Driver(OCD) Impedance Adjustment
• On Die Termination with selectable values(50/75/150 ohms or disable)
• PASR(Partial Array Self Refresh)
• Average Refresh Period 7.8us at lower than a TCASE 85°C, 3.9us at 85°C < TCASE < 95 °C
- support High Temperature Self-Refresh rate enable feature
• Package: 84ball FBGA - 64Mx16, 70ball FBGA - st.256Mx8
• All of Lead-free products are compliant for RoHS


Specifications

Symbol Parameter Rating Units Notes
VDD Voltage on VDD pin relative to VSS - 1.0 V ~ 2.3 V V 1
VDDQ Voltage on VDDQ pin relative to VSS - 0.5 V ~ 2.3 V V 1
VDDL Voltage on VDDL pin relative to VSS - 0.5 V ~ 2.3 V V 1
VIN, VOUT Voltage on any pin relative to VSS - 0.5 V ~ 2.3 V V 1
TSTG Storage Temperature -55 to +100 °C 1, 2

Note :
1. Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the  evice. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating  onditions for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2 standard.




Customers Who Bought This Item Also Bought

Margin,quality,low-cost products with low minimum orders. Secure your online payments with SeekIC Buyer Protection.
You may also be interested in :
Integrated Circuits (ICs)
TA8435H
1MB12-140
Circuit Protection
A50QS75-4Y
F-17*77
LED Products
LM24P20
KCG057QV1DB-G770
Potentiometers, Variable Resistors
RV24YN
WXD4-23-3W
Filters
PICO2205A
PICO2204A
Optoelectronics
SFH7770
TLP423J
View more