Position: Home > Blog Center >
Low Cost Custom Prototype PCB Manufacturer

IC Blog Center

Index 19

New MOSFETs from Infineon Touts High Efficiency, Power Density and Low RDS(on) in SMPSs

Published:2012/2/7 21:54:00 Author:Amy

Infineon Technologies has announced new OptiMOS 40-V and 60-V power MOSFET families, which are improved for synchronous rectification in Switched Mode Power Supplies (SMPS) including those deployed in servers and desktop PCs. The devices are an ideal option for industrial applications such as motor control, solar micro inverters and fast sw...   (View)

View full text | Comments | Reading(776)

Altium Worked with FTDI Chip for New Board-Level Components

Published:2012/2/7 20:18:00 Author:Amy

Altium and Future Technology Devices International (FTDI Chip) has introduced the full range of board-level IC component solutions on the basis of their cooperation. By the use of Altium Designer, designers are able to have direct access to new components such as a comprehensive rang of FTDI Chip devices to satisfy their USB connectivity needs. FTDI provides an easy route for the addition of a USB port int...   (View)

View full text | Comments | Reading(543)

Fairchild Announced New FL7730 Single-Stage PSR Controller

Published:2012/2/7 6:12:00 Author:Amy

Fairchild Semiconductor introduced the FL7730 single-stage primary side regulation (PSR) controller with power factor correction (PFC), TRIAC and analog dimming compatibility, as well as the FL7732 for non-dimming applications. The FL7730 is an active PFC controller designed for single-stage flyback topology application. In addition, the devi...   (View)

View full text | Comments | Reading(527)

The Cooperation between Samsung and Cadence Benefits each other

Published:2012/2/7 2:46:00 Author:Li xiao na

The cooperation between Samsung Electronics’ foundry business and Cadence allows developing a design-for-manufacturing (DFM) infrastructure. This involves the development of “in-design” and signoff DFM flows to deal with physical signoff and electrical variability optimisation for 32-, 28- and 20nm system-on-chip (SoC) designs. <...   (View)

View full text | Comments | Reading(467)

Intense Announces 30W 808nm Laser Pump Modules

Published:2012/2/7 1:14:00 Author:Phyllis

Intense Inc recently announced the release of a high power 30W version of the Series 8000 808nm High Power Laser Pump Modules which delivers 30W of output power from a 200 micron core fiber, 0.15 or 0.22 Numerical Aperture. The laser is designed to meet growing demand for fiber or solid state pumping applications. Its compact size and combination of efficiency and high brightness make it a high performance ...   (View)

View full text | Comments | Reading(516)

Rambus Cooperate with Unity Semiconductor

Published:2012/2/7 0:23:00 Author:Phyllis

Rambus Inc. has announced to buy memory from Unity Semiconductor Corp, reaching a sum of $35 million in cash. Founded in 2002, Unity Semiconductor was concentrate on developing metal oxide based cross-point two-terminal non-volatile memory cell named as CMOx with plans to enter the market with a terabit memory. Metal-oxide, or some other resistive (View)

View full text | Comments | Reading(504)

Ioxus Introduced New iCAP 3,000 Farad (F) Ultracapacitor

Published:2012/2/6 2:34:00 Author:Amy

Ioxus, Inc. introduced the new iCAP 3,000 Farad (F) ultracapacitor, which is claimed as the first size in a new family of cell products. With the lowest weight, lowest equivalent series resistance (ESR) and highest power density available in the market, these ultracapacitors are very suited for energy storage cells. The device is widely used in transportation drive, grid power storage, regenerative energy captur...   (View)

View full text | Comments | Reading(927)

Infineon Introduced a New H-PSOF power-electronics packaging

Published:2012/2/6 1:12:00 Author:Phyllis

Infineon’s latest packaging technology, which is compliant with JEDEC standard H-PSOF (Heatsink Plastic Small Outline Flat lead), provide high-current capability and high efficiency for demanding automotive electronics applications, including electric and hybrid vehicles. The first available products using the H-PSOF package technology are 40V OptiMOS™ T2 power (View)

View full text | Comments | Reading(964)

WinSystems Introduced New PC-104 DC-DC Power Supply

Published:2012/2/6 0:24:00 Author:Amy

WinSystems introduced two new PC-104 wide input range, DC/DC power supplies. The input voltage range is from 10 V to 50 VDC which enables them to work well with 12-V, 24-V, or 48-V battery operated or distributed DC power systems. The standard output voltage for the PCM-DC-AT500 is +5V at 20A. For the triple output PCM-DC-AT512, the voltage...   (View)

View full text | Comments | Reading(593)

Microsemi and TRINAMIC Announced a New Motor Control Kit

Published:2012/2/6 0:11:00 Author:Phyllis

Microsemi and TRINAMIC have just announced the availability of a new motor control kit that allows designers to lower product-development costs and bring products to market quickly. This FPGA-based dual motor control kit contains Microsemi’s SmartFusion evaluation kit and TRINAMIC’s motor control daughter board kit. Microsemi’s SmartFusion customizable (View)

View full text | Comments | Reading(484)

TRaC’s new Southern Labs has been opened by Defence Minister

Published:2012/2/5 21:36:00 Author:Li xiao na

Peter Luff MP is the minister of defence equipment, who has attend the formal opening at the inauguration of TRac’s new Southern Labs in Three Legged Cross, Wimborne, Dorset. The test house tries to consolidate and enlarge its EMS and environmental test services at this single location. Three Chambers (screened rooms) are installed by TRac to a wide range of military and aerospace standards. A further two c...   (View)

View full text | Comments | Reading(832)

TDK-Lambda Announced 500W Power Supplies with 90% Efficiency

Published:2012/2/3 2:30:00 Author:Amy

TDK-Lambda Americas has announced a new line of “green” 500-watt power supplies, which is very suited for use in industrial, broadcast, and communications applications, the GWS500 series power supplies employ innovative design techniques to combine high efficiency, high power density and low standby power consumption (<0.5W, no-load) with the confidence of a 5-year warranty. It is a 500W ac-dc, force...   (View)

View full text | Comments | Reading(856)

FTDI’s Shield Used for the Vinco Development Module

Published:2012/2/3 2:03:00 Author:Li xiao na

Future Technology Devices International (FTDI) is a Scottish privately traded semiconductor device company, which specialized in Universal Serial Bus (USB) technology. FTDI provides application-specific integrated circuit (ASIC) design services. The consultancy services are also provided by this firm for product design, specifically in the realm of electronic devices. The firm is headquartered in Glasgow, Scotl...   (View)

View full text | Comments | Reading(842)

Wolfson Introduced Miniature Audio Hub Used for Tablets and Smartphones

Published:2012/2/3 1:49:00 Author:Amy

Wolfson Microelectronics plc has released the WM1811, which is claimed to be the loudest, smallest Audio Hub. This new ultra-low power stereo audio hub has prolonged battery life and enriched audio quality. It is intended for MP3 music and video playback in smartphones and other portable devices rich in multimedia features, including tabl...   (View)

View full text | Comments | Reading(481)

TSMC Plans to Announce 3-D IC Assembly Service

Published:2012/2/3 1:00:00 Author:Phyllis

Taiwan Semiconductor Manufacturing Company (TSMC) plans to announce 3-D IC assembly service as a general offering at the beginning of 2013. Called COWOS internally, the technology is standing for chip on wafer on substrate. The company has one year to get all physical design kits and EDA support in place to allow customers to design with COWOS. TSMC is already working with companies such as Xilinx o...   (View)

View full text | Comments | Reading(836)

The World’s Wireless Spending has been Larger than that for Computers in 2011

Published:2012/2/3 0:27:00 Author:Phyllis

In 2011, driven by the red-hot appeal of items like Apple’s iPhone and iPad, the wireless communications sphere surpassed computers to lead all segments in semiconductor-related spending among the world’s leading OEMs, according to IHS iSuppli. The world’s top OEM’s spending on microchips for wireless products amounted to $5...   (View)

View full text | Comments | Reading(746)

Express Logic Released ThreadX RTOS and NetX Duo TCP-IP Stack to Improve Cortex-M4 Performance

Published:2012/2/2 1:39:00 Author:Amy

Express Logic recently introduced that it has ported the popular ThreadX RTOS and NetX TCP/IP stack to support a wide range of processors based on ARM’s Cortex-M4. ThreadX has been adopted in over 1 billion electronic products including consumer electronics, medical devices, and industrial control systems—systems where Cortex-M4 is an ideal fit. NetX Duo has achieved near-wire speed on Cortex-M4-based platforms ...   (View)

View full text | Comments | Reading(632)

Maxim Introduced the MAX16919/MAX16969 Hi-Speed USB Protectors

Published:2012/2/2 0:55:00 Author:Amy

Maxim Integrated Products, a worldwide manufacturer of highly integrated analog and mixed-signal semiconductors, introduced the MAX16919/MAX16969 Hi-Speed USB 2.0 automotive-grade protectors with iPod/iPhone fast-charge detection and USB host-charger detection for all USB gadgets. The protectors feature fast-charge detecti...   (View)

View full text | Comments | Reading(652)

Samsung Selected Javelin Semiconductor’s CMOS 3G Power Amplifier

Published:2012/2/2 0:23:00 Author:Phyllis

Javelin Semiconductor is an innovator of the world’s first high-performance CMOS 3G power amplifier (PA). Its JAV5501 Band I PA for new Galaxy smartphones has selected by Samsung Electronics Co. The initial Samsung phone model available with Javelin’s PA is the Galaxy Ace Plus, a mid-range Android-based 3G smartphone. Following the widely pop...   (View)

View full text | Comments | Reading(715)

The Wireless Speaker and Audio Association

Published:2012/2/1 23:46:00 Author:Li xiao na

In order to advance the adoption of wirelessly transmitted high-definition surround-sound in the home theatre environment, the Wireless Speaker and Audio (WiSA) Association has been set-up. The advisory board members include many large companies, such as Pioneer, Sharp, Aperion Audio, Polk Audio, Definitive Technology, Hansong Klipsch, Meiloon, Silicon Image and Summit (View)

View full text | Comments | Reading(573)

Pages:19/114 1234567891011121314151617181920Under 20