IC Blog Center

TI adapts HD for 3-D printing

Published:2012/6/20 1:42:00 Author:Ecco

Texas Instruments announced that they would adapt their HD digital light processor (DLP) chipset this week for rapid prototyping systems that can print 3-D objects. The surface of a receding photo-activated polymer can be formed into 3-D objects f...   (View)

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Freescale samples the firstly ultra-low-power ARM core

Published:2012/6/19 2:00:00 Author:Ecco

Freescale Semiconductor Inc. is available to provide the samples of the industry's first microcontroller to use ARM's ultra-low-power Cortex-M0+ (View)

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Ford pushes APIs for Android in Silicon Valley lab

Published:2012/6/18 23:15:00 Author:Ecco

When Giuli was fresh out of engineering grad school at Stanford University nine years ago, he joined Ford’s Dearborn, Mich., labs. He’s been working on setting up Ford’s presence in Silicon Valley philosophically for a long time, but the actual work of finding and setting up an office h...   (View)

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Silicon Valley Bank will set China venture

Published:2012/6/18 2:14:00 Author:Ecco

With its professional chip knowledge, Silicon Valley bank goes to the mainland to aim to be the first U.S. tech-focused bank operating in China by September when it opens the doors on a new joint venture. SVB has about $20 billion in assets. It forged a 50/50 joint venture with the considerably larger Shanghai Pudong Developme...   (View)

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Three-year research project is developed to avoid rare-earth metals

Published:2012/6/17 22:31:00 Author:Ecco

There is a three-year research project about the design of next generation electric vehicle motors. It aims to eliminate the use of expensive magnetic materials. The total value of the project is about £1.5 million ($2.3 million), half-fu...   (View)

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The story about Samsung Galaxy S3 smartphone

Published:2012/6/15 2:26:00 Author:Ecco

Samsung was immature in the handset industry before 3 years. Its sales and stature were fallen behind other handset companies such as Nokia, Motorola and so on. When Apple entered the fray with the introduction of the (View)

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The phased array satellite system will be pushed

Published:2012/6/14 23:09:00 Author:Ecco

A UK startup will push a kind of phased array antenna system which allows moving vehicles to communicate with satellites and antennas to track satellites. Phasor Solutions Ltd. uses the 155-GHz SiGe process from TowerJazz to replace GaAs for the transceivers alongside its phase array antenna design. The Farnborough Air Show will be holden next month, which is targeting the multi-billion dollar satellite com...   (View)

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The gate-last HKMG options are reported by IMEC

Published:2012/6/14 1:44:00 Author:Ecco

The so-called replacement metal gate (RMG) technology is evaluated by Nanoelectronics research center IMEC. It is reported that the technology can allow further transistor scaling and follow-on to the high-k metal gate (HKMG) structures currently in use. According to the papers on the topic at the VLSI Technology Symposium taking place June 12 to 15 in Honolulu, Hawaii presented by IMEC researchers, its co...   (View)

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Toshiba shows its NAND flash sales

Published:2012/6/13 22:07:00 Author:Ecco

The NAND flash memory sales of Toshiba Corp. was $1.71 billion in the first quarter with increasing 19 percent from the fourth quarter of 2011. According to IHS iSuppli, it was the highest growth rate among ...   (View)

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ARM provides some details about Mali-450

Published:2012/6/13 2:55:00 Author:Ecco

Some details of the Mali-450 is pushed by processor intellectual property licensor ARM Holdings plc (Cambridge, England). Mali-450 is a graphics processor which is based on ARM’s Utgard architecture. The Mali-450, which is offered as synthesiz...   (View)

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ST develops 28-nm, 20-nm FDSOI with GlobalFoundries

Published:2012/6/11 21:32:00 Author:Ecco

Chip vendor STMicroelectronics NV has announced that it can produce the devices using 28-nm and 20-nm fully depleted silicon-on-insulator (FDSOI) technology by signing up with GlobalFoundries. As a part of the same deal, ST is opening up the...   (View)

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HDD prices will remain above pre-disaster levels until 2014

Published:2012/6/11 4:47:00 Author:Ecco

Market research firm IHS iSuppli indicates that the average selling prices (ASPs) of hard disk drives (HDDs) may remain higher level in the rest of this year because of rampant flooding in Thailand last year. And the HDD ASPs are expected to remain inflated until 2014. HDD production is rapidly reco...   (View)

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Foundries sales were in diverging trends in May

Published:2012/6/11 3:00:00 Author:Ecco

Until May, Foundry Taiwan Semiconductor Manufacturing Co. Ltd has strong sequential and annual sales growth in May while smaller rival United Microelectronics Corp. has a year-on-year decline in sales. According to TSMC, its net sales for May 2012 on an unconsolidated basis were NT$43.62 billion (about $1.48 billion), an increase of ...   (View)

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Lapis develops Nanoampere MCU to serve sensors

Published:2012/6/8 4:17:00 Author:Ecco

Lapis Semiconductor Co. Ltd. (Tokyo, Japan) is changed from a Rohm Group company which is known for Oki Semiconductor. Now, it has developed a low-power microcontroller which is designed to serve as a sensor hub and potentially as a host for sensor-fusion software. The ML610Q792 includes 64-kbytes flash ROM, with on-board writing sup...   (View)

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Samsung costs $1.9 billion on logic fab, says Reuters

Published:2012/6/8 2:24:00 Author:Ecco

Reuters made a report to indicate that Samsung Electronics Co. Ltd. would build a wafer fab line for logic chips in support of smartphones and tablet computers with $1.9 billion. The report did not show whether the plan would be an additional module within an established fab or stand-alone wafer fab or where the investment would be l...   (View)

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Netronome Systems Inc. pushes NFP-6xxx flow processors

Published:2012/6/7 2:09:00 Author:Ecco

Netronome Systems Inc. is a company which specialized in a fabless network processor. It has pushed the NFP-6xxx family of flow processors which can operate at up to 200-Gbits per second with Intel's 22-nm FinFET manufacturing process tech...   (View)

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MiraMEMS in China offers tri-axis accelerometer

Published:2012/6/7 1:15:00 Author:Ecco

Founded in 2011, MiraMEMS Sensing Technology Co. Ltd. (Suzhou, China) startup offers three-axis capacitive linear accelerometer part numbered MM3A310. It is composed of a surface micromachined sensor element and an ASIC signal conditioning and interface die. The MM3A310 can be packaged in a 3-mm by 3-mm by 1-mm land grid array. ...   (View)

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SIA, WSTS forecast flat chip sales in 2012

Published:2012/6/6 2:47:00 Author:Ecco

The Semiconductor Industry Association (SIA) and World Semiconductor Trade Statistics (WSTS) group expect that chip sales will increase less ...   (View)

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MicroGen transfers specific manufacturing process to X-Fab

Published:2012/6/6 1:27:00 Author:Ecco

Fabless startup MicroGen Systems Inc. makes a statement to indicate that it has chosen X-Fab Semiconductor Foundries AG to mass produce MEMS-based energy harvesters for the company. Established in 2007, MicroGen has developed a range of piezoelectric vibrational energy harvesting devices. The company is also working on broadband ener...   (View)

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Freescale develops black-box sensor integration for Win8

Published:2012/6/5 21:19:00 Author:Ecco

Freescale Semiconductor plans to develop Windows 8 with a 12-axis sensor development reference platform which is a kind of black-box of sensor integration. The platform aims to dramatically reduce system complexity by the components which include an Xtrinsic MPL3115A2 precision altimeter, Xtrinsic MMA8451Q 3-axis accelerome...   (View)

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