Published:2012/2/6 1:12:00 Author:Phyllis From:SeekIC
Infineon’s latest packaging technology, which is compliant with JEDEC standard H-PSOF (Heatsink Plastic Small Outline Flat lead), provide high-current capability and high efficiency for demanding automotive electronics applications, including electric and hybrid vehicles. The first available products using the H-PSOF package technology are 40V OptiMOS™ T2 power transistors offering up to 300A current capability in addition to an RDS(on) of 0.76 mΩ.
Higher performance power electronics components help automotive system designers comply with government regulations mandating higher standards for fuel efficiency while also demanding lower overall emissions. To meet these standards, power MOSFETs with current capability above 200A and RDS(on) below 1 mΩ are needed to reduce conduction losses and improve overall efficiency.
The dimensions and the height of the H-PSOF package were reduced compared to a standard D2PAK package (TO-263) typically used in such applications. The footprint of the H-PSOF package is about 20% smaller and its height is almost half that of the current D2PAK package.
The H-PSOF package was designed for applications include battery management for hybrid and electric vehicles, electric power steering (EPS), active alternators, and other heavy load applications enabling higher efficiency and lower emissions.
Infineon says the main goal for the development of the H-PSOF package was to decrease the package resistance and increase the current capability of the package compared to the D2PAK offering high-current capabilities.
The H-PSOF package also has assembly and manufacturing advantages. Its special design ensures a good wetting for reliable soldering and it is possible to control the soldered leads by using automatic optical inspection, which is usually part of a surface-mount technology production line.
The first available product using the H-PSOF package is the IPLU300N04S4-R7, a member of the 40V OptiMOS T2 automotive power transistor family from Infineon, which is also used for applications in energy efficiency, CO2 reduction, and electric drives. The IPLU300N04S4-R7 offers a continuous drain current (ID) of 300A with RDS(on) of 0.76 mΩ. The power devices in the H-PSOF package are qualified according to AEC-Q101 standards. Infineon plans to introduce further 40V and 30V automotive MOSFETs using the H-PSOF package technology.
Infineon Technologies engages in the design, development, manufacture, and marketing of semiconductors and system solutions primarily in Europe, Asia, and North America. Its products include standard commodity components, full-custom devices, semi-custom devices and system solutions, and application-specific components for analog, digital, and mixed-signal applications, as well as embedded, non-volatile memories.
Reprinted Url Of This Article: http://www.seekic.com/blog/IndustryNews/2012/02/06/Infineon_Introduced_a_New_H_PSOF_power_electronics_packaging.html
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