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W682310R, W682310RG, W682388

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Info of W682310R
Info of W682310RG
Info of W682388

W682310R, W682310RG, W682388 Selling Leads, Datasheet

MFG:winbond Package Cooled:NO STOCK D/C:2009

W682310R, W682310RG, W682388 Datasheet download

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Part Number: W682310R

MFG: winbond

Package Cooled: NO STOCK

D/C: 2009

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W682388 General Description

The Winbond W682388 Pro-X ™ CODEC family is an excellent solution for short loop telephony applications. Place the components carefully to insure best performance. This document outlines critical component layout issues. Use it together with the W682388 data sheet and other supporting Pro-X application notes.

The W682388 will exhibit high-quality low-noise performance with the appropriate layout design. Pins 5261 are sensitive current input pins that are susceptible to induced noise. Keep traces between these pins and their respective components (C7, C8, C10, C11, R1316, and R1827) to a minimum length. Do not route any digital traces near these sensitive traces.

Place the line compensation capacitors, C5, C8, C9, and C12, near their respective TIP and RING output pins. Place a 0.1 µF ceramic decoupling capacitor as close as possible to eachVDD and VBAT power supply input pin. These are Pin 49 (VDD1), Pin 64 (VDD2), Pin 41 (VDD3), Pin 8 (VDD4), Pin 27 (VDD5) and Pin 26 (VDDL). Replace the 0.1 µF capacitors at VDD1 and VDD2 with 10 µF ceramic capacitors for additional noise performance. Refer to the Figure 3 for an example of this layout.

There are two external Tip and Ring capacitors for each channel. They are connected to CT1 (Pin 39), CR1 (Pin 38), CT2 (Pin 10), and CR2 (Pin 11). The capacitor is a 10 µF ceramic (low leakage) capacitor. It is connected to 3.3V. Route the capacitors directly to the appropriate VDD pin. For example, the CT1 and CR1 capacitors connect directly to their respective pins. Their shared 3.3V connection is routed directly to VDD1 before connecting to the main 3.3V supply. The situation is the same for CT2 and CR2, which must
terminate at VDD2.

The AFE transistors QR3/QT3 (SOT-223) and QR1/QT1 (SOT-89) should have exposed copper pads to help reduce the thermal resistance of these components. The amount of copper used for the heat sink in combination with the surface area of the PCB will improve the heat dissipation of the transistor package.

One way to increase the copper area when board space is limited is to connect the pad used for the heat sink by using multiple layers. A top and bottom side can be used with multiple vias connecting them together. The optimal copper area to heat sink a SOT-223 is 1 sq inch. This approach is similar to heat sinking used for the QFN package. (Refer to Section 4 on QFN grounding) Place the resistors for IREF (Pin 13) and the transconductance amplifiers (Pins 3,5,44 and 46) as close as possible to the part to minimize the trace length. These resistors are R29, R30 and R31.

If more than two layers are used for the overall board circuit, separate analog and digital trace layers may enhance performance. Digital signals are best applied to a dedicated layer. The ideal approach is to separate digital layers from analog layers by a power/ground plane.

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