RFM12N08, RFM12N10, RFM12N10L Selling Leads, Datasheet
MFG:MOT/ON Package Cooled:01+ D/C:07+
RFM12N08, RFM12N10, RFM12N10L Datasheet download
Part Number: RFM12N08
MFG: MOT/ON
Package Cooled: 01+
D/C: 07+
RFM12N08, RFM12N10, RFM12N10L
- Table of contents:
Info of RFM12N08
Info of RFM12N10
Info of RFM12N10L
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About RFM12N08
PDF/DataSheet Download
Datasheet: RFM12N08
File Size: 44246 KB
Manufacturer: INTERSIL [Intersil Corporation]
Download : Click here to Download
About RFM12N10
PDF/DataSheet Download
Datasheet: RFM12N10
File Size: 44246 KB
Manufacturer: INTERSIL [Intersil Corporation]
Download : Click here to Download
About RFM12N10L
PDF/DataSheet Download
Datasheet: RFM12N10L
File Size: 39560 KB
Manufacturer:
Download : Click here to Download
RFM12N08 Maximum Ratings
| RFM12N08 | RFM12N10 | RFP18N08 | RFP18N10 | UNITS | |
| Drain to Source Voltage (Note 1) VDSS | 80 | 100 | 80 | 100 | V |
| Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR | 80 | 100 | 80 | 100 | V |
| Continuous Drain Current ID | 12 | 12 | 12 | 12 | A |
| Pulsed Drain Current (Note 3) IDM | 30 | 30 | 30 | 30 | A |
| Gate to Source Voltage VGS | ±20 | ±20 | ±20 | ±20 | V |
| Maximum Power Dissipation PD | 75 | 75 | 60 | 60 | W |
| Continuous (TC= 100oC, VGS = 10V) (Figure 2) ID | 0.6 | 0.6 | 0.48 | 0.48 | W/oC |
| Operating and Storage Temperature .TJ, TSTG | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 | oC |
| Maximum Temperature for Soldering | |||||
| Leads at 0.063in (1.6mm) from Case for 10s. TL | 300 | 300 | 300 | 300 | o C |
| Package Body for 10s, See Techbrief 334 Tpkg | 260 | 260 | 260 | 260 | o C |
RFM12N08 Features
• 12A, 80V and 100V
• rDS(ON) = 0.200W
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
• rDS(ON) = 0.200W
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
RFM12N10 Maximum Ratings
| RFM12N08 | RFM12N10 | RFP18N08 | RFP18N10 | UNITS | |
| Drain to Source Voltage (Note 1) VDSS | 80 | 100 | 80 | 100 | V |
| Drain to Gate Voltage (RGS = 1MW) (Note 1)VDGR | 80 | 100 | 80 | 100 | V |
| Continuous Drain Current ID | 12 | 12 | 12 | 12 | A |
| Pulsed Drain Current (Note 3) IDM | 30 | 30 | 30 | 30 | A |
| Gate to Source Voltage VGS | ±20 | ±20 | ±20 | ±20 | V |
| Maximum Power Dissipation PD | 75 | 75 | 60 | 60 | W |
| Continuous (TC= 100oC, VGS = 10V) (Figure 2) ID | 0.6 | 0.6 | 0.48 | 0.48 | W/oC |
| Operating and Storage Temperature .TJ, TSTG | -55 to 150 | -55 to 150 | -55 to 150 | -55 to 150 | oC |
| Maximum Temperature for Soldering | |||||
| Leads at 0.063in (1.6mm) from Case for 10s. TL | 300 | 300 | 300 | 300 | o C |
| Package Body for 10s, See Techbrief 334 Tpkg | 260 | 260 | 260 | 260 | o C |
RFM12N10 Features
• 12A, 80V and 100V
• rDS(ON) = 0.200W
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
• rDS(ON) = 0.200W
• Related Literature- TB334 "Guidelines for Soldering Surface Mount Components to PC Boards"
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