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Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300
°C
IXSH30N60AU1 Features
• International standard package JEDEC TO-247 AD • High frequency IGBT with guaranteed Short Circuit SOA capability • IGBT and anti-parallel FRED in one package • 2nd generation HDMOSTM process • Low VCE(sat) - for low on-state conduction losses • MOS Gate turn-on - drive simplicity
IXSH30N60AU1 Typical Application
• AC motor speed control • DC servo and robot drives • DC choppers • Uninterruptible power supplies (UPS) • Switch-mode and resonant-mode power supplies
Maximum lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s
300
°C
IXSH30N60B Features
· International standard packages · Short Circuit SOA capability · High frequency IGBT New generation HDMOSTM process
IXSH30N60B Typical Application
· AC motor speed control · DC servo and robot drives · DC choppers · Uninterruptible power supplies (UPS) · Switch-mode and resonant-mode power supplies
