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Maximum Lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Maximum Tab temperature for soldering SMD devices for 10 s
300 260
Md
Mounting torque, TO-247
1.13/10
Nm/lb.in.
Weight
TO-247 AD
6
g
IXSH24N60AU1 Features
• International standard package JEDEC TO-247 AD • High frequency IGBT and anti-parallel FRED in one package • 2nd generation HDMOSTM process • Low VCE(sat) - for minimum on-state conduction losses • MOS Gate turn-on - drive simplicity • Fast Recovery Epitaxial Diode (FRED) - soft recovery with low IRM
IXSH24N60AU1 Typical Application
• AC motor speed control • DC servo and robot drives • DC choppers • Uninterruptible power supplies (UPS) • Switch-mode and resonant-mode power supplies
Maximum Lead temperature for soldering 1.6 mm (0.062 in.) from case for 10 s Maximum Tab temperature for soldering SMD devices for 10 s
300 260
Md
Mounting torque, TO-247
1.13/10
Nm/lb.in.
Weight
TO-247 AD
6
g
IXSH24N60U1 Features
• International standard package JEDEC TO-247 AD • High frequency IGBT and anti-parallel FRED in one package • 2nd generation HDMOSTM process • Low VCE(sat) - for minimum on-state conduction losses • MOS Gate turn-on - drive simplicity • Fast Recovery Epitaxial Diode (FRED) - soft recovery with low IRM
IXSH24N60U1 Typical Application
• AC motor speed control • DC servo and robot drives • DC choppers • Uninterruptible power supplies (UPS) • Switch-mode and resonant-mode power supplies
