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Drain Current Continuous(TC= 25, VGS = 10V) (Figure 2)
ID
22
A
Drain Current Continuous(TC= 100, VGS = 10V) (Figure 2)
ID
15
A
Drain Current Pulsed Drain Current
IDM
Figure 4
Pulsed Avalanche Rating
EAS
Figures 6, 14, 15
Power Dissipation
PD
85
W
Derate Above 25
0.57
W/
Operating and Storage Temperature
TJ,TSTG
-55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s.
TL
300
Package Body for 10s, See Techbrief 334
Tpkg
260
NOTE:
1. TJ = 25 to 150.
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
HUF75623S3ST Features
• Ultra Low On-Resistance - rDS(ON) = 0.064, VGS = 10V • Simulation Models - Temperature Compensated PSPICE® and SABER™ Electrical Models - Spice and SABER Thermal Impedance Models - www.fairchildsemi.com • Peak Current vs Pulse Width Curve • UIS Rating Curve
HUF75631P3 Parameters
Technical/Catalog Information
HUF75631P3
Vendor
Fairchild Semiconductor
Category
Discrete Semiconductor Products
Mounting Type
Through Hole
FET Polarity
N-Channel
Drain to Source Voltage (Vdss)
100V
Current - Continuous Drain (Id) @ 25° C
33A
Rds On (Max) @ Id, Vgs
40 mOhm @ 33A, 10V
Input Capacitance (Ciss) @ Vds
1220pF @ 25V
Power - Max
120W
Packaging
Tube
Gate Charge (Qg) @ Vgs
79nC @ 20V
Package / Case
TO-220AB
FET Feature
Standard
Lead Free Status
Lead Free
RoHS Status
RoHS Compliant
Other Names
HUF75631P3 HUF75631P3
HUF75631P3 Maximum Ratings
HUF75631P3
UNITS
Drain to Source Voltage (Note 1)
VDSS
100
V
Drain to Gate Voltage (RGS = 20k) (Note 1)
VDGR
100
V
Gate to Source Voltage
VGS
±20
V
Drain Current Continuous (TC= 25, VGS = 10V)(Figure 2).
ID
33
A
Drain Current Continuous (TC= 100, VGS = 10V)(Figure 2).
ID
23
A
Drain Current Pulsed Drain Current
IDM
Figure 4
Pulsed Avalanche Rating
EAS
Figures 6,14,15
Power Dissipation
PD
120
W
Derate Above 25
0.80
W/
Operating and Storage Temperature
TJ,TSTG
-55 to 175
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s.
TL
300
Package Body for 10s, See Techbrief 334
Tpkg
260
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. TJ = 25 to 150.